Study on the Surface Characteristics of Polishing Pad Used in Chemical Mechanical Polishing

Hong Gao; Jian Xiu Su

doi:10.4028/www.scientific.net/AMR.102-104.724

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 102-104Study on the Surface Characteristics of Polishing...

Study on the Surface Characteristics of Polishing Pad Used in Chemical Mechanical Polishing

Abstract:

Studying the surface characteristics of polishing pad helps to understand and analyze the chemical mechanical polishing (CMP) mechanism and optimize the microscopic structure of polishing pad. The surface roughness, organizational structure, porosity, depth and diameter of micro-pore, distribution of asperity and profile bearing rate of IC1000/Suba IV polishing pad were studied with the profilometer ZYGO 5022, AFM and SEM. The results of measurement and calculation show that the surface roughness is 6.8μm , the root mean square ( RMS ) roughness is 9.4μm, the surface porosity is 56 % , the micro-pore average diameter is 36μm , the micro-pore average depth is 20μm , the micro-pore average spacing is 43μm , the micro-pore average volume is 550/mm2 and the asperity height obeys Gaussian distribution.

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Periodical:

Advanced Materials Research (Volumes 102-104)

Pages:

724-728

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.102-104.724

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Online since:

March 2010

Authors:

Hong Gao, Jian Xiu Su

Keywords:

CMP, Material Removal Mechanism, Polishing Pad, Polymer Material, Surface Characteristic

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