Ceramic Sample Preparation by Polishing Process for Nano-Indentation

Ji Sheng Sheng; Dong Hui Wen; Shi Ming Ji

doi:10.4028/www.scientific.net/AMR.102-104.742

Paper Titles

Study on the Surface Characteristics of Polishing Pad Used in Chemical Mechanical Polishing
p.724

Drilling Force in High Speed Drilling Carbon Fibre Reinforced Plastics (CFRP) Using Half Core Drill
p.729

Influence of Grinding Parameters on the Depth and Uniformity of Cylindrical Grinding-Hardened Layer
p.733

Micro-Quality Control on Ultra-Precision Machining of Sapphire Substrates
p.738

Ceramic Sample Preparation by Polishing Process for Nano-Indentation
p.742

Research on Material Removal Modeling and Processing Parameters of Magnetorheological Finishing
p.746

The Research in Algorithm for MRF Forming Dwell Time of Optical Components
p.750

Virtual Simulation and Optimization for 5-Axis Milling Process
p.754

Study on Surface Roughness of High-Speed Cutting of Ni-Base Superalloy under Different Cutting Media
p.758

HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 102-104Ceramic Sample Preparation by Polishing Process...

Ceramic Sample Preparation by Polishing Process for Nano-Indentation

Abstract:

Ceramic materials are widely used in the fields of aviation, chemical industry, military, machinery, electronics, so there are so many researches on ceramic materials. This article is mainly about ceramic sample preparation by polishing process for nano-indentation, taking Alumina ceramic and Zirconia ceramic for example. As we know, nano-indentation test is an effective mean to study materials. It is concluded that after polishing, the ceramic surface roughness can reach Ra<10nm and maximum scratches<1nm, flatness<1μm, we can get good quality surface, that well meets the surface requirements in nano-indentation.