Micro-Quality Control on Ultra-Precision Machining of Sapphire Substrates

Abstract:

This paper proposed a new approach to control the micro-quality of sapphire substrate, in order to grow GaN on substrate. The main factors that influence macro-quality are the method of slicing, grinding and polishing. Thread speed of slicing is less than 0.5m/s. Ductile mode grinding of substrate is achieved by #3000 diamond wheel and feed of 1μm/r. The suitable polishing conditions are that the SiO2 grain size is less than 10nm, the concentration SiO2 is 3％, pH value of polishing liquid is 10.5 and polishing stress is 190Pa. The undamaged substrates have been obtained steadily. The surface roughness RMS is less than 0.4 nm.

• Periodical: Advanced Materials Research (Volumes 102-104)
• Pages: 738-741
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.102-104.738
• Online since: March 2010
• Authors: Hai Zhou, Li Gang Bai, Dai Pin Wang
• Keywords: Chemical Mechanical Polishing (CMP), Depth of Damaged Layer, Ductile Mode Grinding, Sapphire Substrate

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