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Online since: October 2010
Authors: Jing Bing Wu, Lun Shu, He Ming Cheng
The Optimal Design of Multi-level Planetary Gear Reducer
Jingbing WU, Lun SHU, Heming CHENG
Mechanical and Electrical Engineering
Wuhan University of Technology, Wuhan, China
wjb@whut.edu.cn, shulun01@sina.com, 184961162@qq.com
Key words: Multi-level planetary gear reducer, Load capacity, Transmission ratio, Optimal design
Abstract.
And optimal allocated drive ratio is practically used in the drive of composite planetary gear reducer, successfully advancing the reducer and greatly improving its performance.
Peng: The Optimal Allocation of Multi-stage Planetary Gear Reducer Transmission Ratio, Technology Forum, (2008) No.9, pp.82-83.
And optimal allocated drive ratio is practically used in the drive of composite planetary gear reducer, successfully advancing the reducer and greatly improving its performance.
Peng: The Optimal Allocation of Multi-stage Planetary Gear Reducer Transmission Ratio, Technology Forum, (2008) No.9, pp.82-83.
Online since: January 2004
Authors: Giovanni Berti, Rob Delhez, B. Peplinski, S. Norval, E. Tolle, J. Verollet
Introduction
Advances in XRD methods suggest that the technique is suitable for the non-destructive
characterisation and testing of materials.
There are many other applications, where traditionally the control of the product or process does not require a non destructive approach in its strict sense, e.g. chemical industry, pharmaceutical technology, materials engineering.
Forum Vol. 228-231 (1996), p. 431 [6] G.
There are many other applications, where traditionally the control of the product or process does not require a non destructive approach in its strict sense, e.g. chemical industry, pharmaceutical technology, materials engineering.
Forum Vol. 228-231 (1996), p. 431 [6] G.
Online since: April 2013
Authors: Ji Hoon Lee, Eugene Rhee
Of Information and Telecommunication engineering, Sangmyung University, Korea
2 Dept.
Of Computer System engineering, Sangmyung University, KoreaFull address of second author, including country 3List all distinct addresses in the same way aevincent@smu.ac.kr, mail, beugenerhee@smu.ac.krmail, cemail Keywords: LWLAN mesh networks, Beacon collision, Probe beacon ist the keywords covered in your paper.
Forum Vol. 83-87 (1992), p. 119 [2] M.A.
Mishing, in: Diffusion Processes in Advanced Technological Materials, edtied by D.
Ju-Wei: IEEE Advanced Info.
Of Computer System engineering, Sangmyung University, KoreaFull address of second author, including country 3List all distinct addresses in the same way aevincent@smu.ac.kr, mail, beugenerhee@smu.ac.krmail, cemail Keywords: LWLAN mesh networks, Beacon collision, Probe beacon ist the keywords covered in your paper.
Forum Vol. 83-87 (1992), p. 119 [2] M.A.
Mishing, in: Diffusion Processes in Advanced Technological Materials, edtied by D.
Ju-Wei: IEEE Advanced Info.
Online since: December 2014
Authors: Angela Viglianisi, Raffaele Scrivo, Lucia Della Spina, Claudia Ventura
Advanced Engineering Forum Vol. 11 (2014), Scientific.net, pp. 204-208. doi: 10.4028/www.scientific.net/AEF.11.204, 2014)
Advanced Materials Research Vols. 869-870, pp 43-48. doi:10.4028/www.scientific.net/AMR.869-870.43, 2014)
In: 5nd KKU International Engineering Conference 2014 (KKU-IENC 2014).
Advanced Materials Research, Vols. 931- 932 (2014) pp 555-559 (Trans Tech Publications, Switzerland doi:10.4028/www.scientific.net/AMR.931-932.555, 2014).
Advanced Materials Research Vols. 869-870, pp 43-48. doi:10.4028/www.scientific.net/AMR.869-870.43, 2014)
In: 5nd KKU International Engineering Conference 2014 (KKU-IENC 2014).
Advanced Materials Research, Vols. 931- 932 (2014) pp 555-559 (Trans Tech Publications, Switzerland doi:10.4028/www.scientific.net/AMR.931-932.555, 2014).
Online since: December 2024
Authors: Abdul Hamid, Masyrukan Masyrukan, Bambang Waluyo Febriantoko, Agus Yulianto, Bibit Sugito, Turnad Lenggo Ginta, Agung Setyo Darmawan
This study advances the field of materials science by providing insights into the complicated relationships between heat treatment techniques and the mechanical properties of nodular cast iron, paving the door for more advanced and specialized applications of this versatile material.
World Journal of Engineering 2020;17:127–33. https://doi.org/10.1108/WJE-11-2019-0327
Materials Science and Engineering: A 2023;868:144757. https://doi.org/10.1016/j.msea.2023.144757
Materials Science and Engineering: A 2022;836:142736. https://doi.org/10.1016/j.msea.2022.142736
Materials Science and Engineering: A 2023;862:144369. https://doi.org/10.1016/j.msea.2022.144369.
World Journal of Engineering 2020;17:127–33. https://doi.org/10.1108/WJE-11-2019-0327
Materials Science and Engineering: A 2023;868:144757. https://doi.org/10.1016/j.msea.2023.144757
Materials Science and Engineering: A 2022;836:142736. https://doi.org/10.1016/j.msea.2022.142736
Materials Science and Engineering: A 2023;862:144369. https://doi.org/10.1016/j.msea.2022.144369.
Online since: November 2016
Authors: Michiya Matsushima, Satoshi Nishioka, Noriyasu Nakashima, Kozo Fujimoto, Shinji Fukumoto
Effects of Hybrid Structures on the Stress Reduction and Thermal Properties of Joints in Electronics Devices
Michiya Matsushima1, Noriyasu Nakashima1 , Satoshi Nishioka1,
Shinji Fukumoto1 and Kozo Fujimoto1
1Graduate School of Engineering, Osaka University
2-1 Yamadaoka, Suita, Osaka, 565-0871, Japan
Keywords: Epoxy resin, Silicone rubber, Electronics devices, Structural design, Stress reduction.
Morida, “Low Temperature Sintering Bonding Process Using Ag Nanoparticles Derived from Ag2O for Packaging of High-temperature Electronics”, Materials Science Forum, Vol.706-709 (2012), 2962-2967
Wong, “Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: Materials, processing, reliability and applications”, Materials Science and Engineering: R: Reports, 51(30), (2006), pp.1-35
Fujimoto, “Effects of material property and structural design on the stress reduction of the joints in electronics devices”, Materials Science Forum, Vols. 783-786, (2014), pp.2765-2770
Furukawa, “Constitutive Relations between Stress, Strain-Rate and Temperature of Copper”, Transactions of the Japan Society of Mechanical Engineers A Vol.56, No.530, (1990), 2152-2156.
Morida, “Low Temperature Sintering Bonding Process Using Ag Nanoparticles Derived from Ag2O for Packaging of High-temperature Electronics”, Materials Science Forum, Vol.706-709 (2012), 2962-2967
Wong, “Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: Materials, processing, reliability and applications”, Materials Science and Engineering: R: Reports, 51(30), (2006), pp.1-35
Fujimoto, “Effects of material property and structural design on the stress reduction of the joints in electronics devices”, Materials Science Forum, Vols. 783-786, (2014), pp.2765-2770
Furukawa, “Constitutive Relations between Stress, Strain-Rate and Temperature of Copper”, Transactions of the Japan Society of Mechanical Engineers A Vol.56, No.530, (1990), 2152-2156.
Online since: December 2012
Authors: Erick Petta Marinho, Alberto Sakata, Erika Fernanda Prados, Gilmar Ferreira Batalha
Superplastic forming of advanced metallic materials – Methods and applications, Woodhead Publishing Limited Cambridge. (2011) 3-30
Mukherjee, Superplastic forming: An analytical approach, Materials Science Engineering, V.
Al-Seif, Compression Testing of Superplastic Lead–Tin Eutectic Alloy at Room Temperature, The Arabian Journal for Science and Engineering, Vol. 30, N. 2B, (2005). pp 177- 188 [16] G.
Conf. on Superplasticity in Advanced Materials, Orlando, USA, Materials Science Forum, v. 357-9, pp. 219-4; ISSN 02555476. 2001 ISBN 0878498745 [18]J.
Curtis, Simulating superplastic forming, Computer Methods In Applied Mechanics and Engineering, v. 195, p. 6580–6603, 2006, [19] M.
Mukherjee, Superplastic forming: An analytical approach, Materials Science Engineering, V.
Al-Seif, Compression Testing of Superplastic Lead–Tin Eutectic Alloy at Room Temperature, The Arabian Journal for Science and Engineering, Vol. 30, N. 2B, (2005). pp 177- 188 [16] G.
Conf. on Superplasticity in Advanced Materials, Orlando, USA, Materials Science Forum, v. 357-9, pp. 219-4; ISSN 02555476. 2001 ISBN 0878498745 [18]J.
Curtis, Simulating superplastic forming, Computer Methods In Applied Mechanics and Engineering, v. 195, p. 6580–6603, 2006, [19] M.
Online since: February 2014
Authors: Pavol Mikula, Miroslav Vrána, Lubos Mraz, Leif Karlsson
Residual stress distributions at high strength steel welds prepared by low transformation temperature (LTT) and conventional welding consumables
Lubos Mraz1,a, Leif Karlsson2,b , Miroslav Vrana3,c and Pavol Mikula3,d
1Welding Research Institute – Industrial Institute SR, 832 59 Bratislava, Slovakia
2University West, Department of Engineering Science, SE-461 86 Trollhättan, Sweden
3Nuclear Physics Institute ASCR, v.v.i., 25068 Rez, Czech Republic
amrazl@mail.t-com.sk, bleif.karlsson@hv.se, cvrana@ujf.cas.cz, dmikula@ujf.cas.cz
Keywords: Residual stress, neutron diffraction, steel weld, low transformation temperature.
Wagner, Strain Scanning Using a Neutron Guide Diffractometer, Proc. of the 5th European Conference on Residual Stresses ECRS-5, Delft-Noordwijkerhout, Netherland; 2000, Materials Science Forum, 347-349 (2000) 113-118
Conference on Advanced Technology in Experimental Mechanics, ATEM´03, September 10-12, 2003, Nagoya, Japan.
CD ROM Published by The Japan Society of Mechanical Engineers No. 03-207, paper OS04W0288
Wagner, Strain Scanning Using a Neutron Guide Diffractometer, Proc. of the 5th European Conference on Residual Stresses ECRS-5, Delft-Noordwijkerhout, Netherland; 2000, Materials Science Forum, 347-349 (2000) 113-118
Conference on Advanced Technology in Experimental Mechanics, ATEM´03, September 10-12, 2003, Nagoya, Japan.
CD ROM Published by The Japan Society of Mechanical Engineers No. 03-207, paper OS04W0288
Online since: October 2011
Authors: Bo Young Hur, Rui Zhao
Correlation between zirconium addition and compressive properties of AZ31 Mg alloy foams
Bo-Young Hur1,a, Rui Zhao1,b
1i-cube center, ERI, ReCAPT, School of Nano & Advanced Materials Science and
Engineering, Gyeongsang National University, Jinju, South Korea 660-701
ahurby@gnu.ac.kr, bruizhao1982@yahoo.cn
Key words: AZ31 Alloy foam; Compression test; Mechanical properties; Energy absorption
Abstract.
The mechanical properties of the metal foams can be engineered to meet the demands of a wide range of applications by altering the size, shape, and volume fraction of cells [3].
Forum Vols. 544-545 (2007) p. 315 [6] C.E.
The mechanical properties of the metal foams can be engineered to meet the demands of a wide range of applications by altering the size, shape, and volume fraction of cells [3].
Forum Vols. 544-545 (2007) p. 315 [6] C.E.