Search results

J. , Sahu S. : Composites Materials, ASTM STP, 170-188, (1972)
Materials, Vol. 35/ 5, 1999
Journal of Applied Polymers Science, 7, p. 1207-1223 (1963)
J. of Materials Science, 1990, 25, 1851-1855
Journal of Vinyl and Additive Technology, (2004), 10 (2), 59-69

Material and Method General Situation of the Research Area and the Remote Sensing Image Preprocessing.
Soil Science: China Agriculture Press (2004).
Soil Science Society of America Journal, 64: 746-753.(2000) [9] Hill J, Schiitt B.
Soil Science Society of America Journal, 44: 1282-1285.(1980) [11] Dahai Liu, Ning Li and Yang Chao: SPSS 15.0 Statistical Analysis from Entry to the Master: Tsinghua University Press: 182-187 (2008).
Soil Science Society of America Journal, 52(4):1023－1026. (1988) [14] Bin Cheng.

Bioactivity is defined as a specific biological response of the materials in a biological environment, which results in strong adhesion between tissue and material [7].
Bioactive materials can be able to bond with host tissue, forming a strong chemical bond [8,9].
Materials and Methods Preparing bone composite.
Allen, T.K.Greenlee, Bonding mechanisms at the interface of ceramic prosthetic materials.
Journal of Biomedical Materials Research, , 24 (6) (1990) 721−734.

Introduction There are different types of materials such as AISI 316L, ASTM F-35 and F-138, which are used for the biomedical applications.
Ultrasonic shot peening (USP) is a novel technique developed for the enhancement in surface properties of materials [4, 5, 6] without changing its chemical composition.
Singh, Effect of surface nanostructure on tensile behavior of superalloy IN718, Materials and Design. 62 (2014) 76–82
Singh, Effect of Ultrasonic Shot Peening on Microstructure and Mechanical Properties of High-Nitrogen Austenitic Stainless Steel, Journal of Materials Engineering and Performance. 23 (2014) 4055–4064
Lu, Surface nanocrystallization of 316L stainless steel induced by ultrasonic shot peening, Materials science and Engineering A286 (2000) 91-95

Creton, Journal of Nuclear Materials, 167-172, 402 (2010)
Murakami, International Journal of Fracture 95, 138-167 (2006)
Robinson, International Journal of Hydrogen Energy 32, 100-116 (2007)
Robertson, Recent advances in the study of structural materials compatibility with hydrogen, Adcanced Materials 22, 1128-1135 (2010)
Yamada, Corrosion Science 44, 407-424 (2002)

Materials and Structures, 20(2):85--95, 1987
ACI Materials Journal, 86(5):475--481, 1989.[7] D.
Molecular-dynamics simulations of twodimensional materials at high strain rates.
Dynamic splitting-tensile test and numerical analysis for brittle materials.
Concrete: Structure, Properties, and Materials, pages 85--86.

Introduction PEEK is one of thermoplastic polymer that can be used for composite materials.
Experimental Materials.
Savage, Studies on the reprocessability of poly(ether ether ketone) (PEEK), Journal of Materials Processing Technology 214 (2014) 75– 80
Zheng, Effect of fiber surface state on mechanical properties of C f /Si–O–C composites, Materials Science and Engineering A 407 (2005) 245–249 [7] T.
LUAN, Interfacial Properties Modification of Carbon Fiber/ Polyarylacetylene Composites, Chinese Journal of Aeronautics 20(2007) 124-128 [9] X.

Preface International Conference on Semiconductor Materials and Technology (ICoSeMT 2019) was an inaugural event organized by Institute of Nano Optoelectronics Research and Technology (INOR), Universiti Sains Malaysia (USM) in conjunction with the 50th Anniversary of USM.
The event has shed some lights via the joint organization with Universiti Teknologi MARA, Cawangan Pulau Pinang (UiTM), and Collaborative Research in Engineering, Science & Technology (CREST) with the Theme “Innovation Towards A Sustainable Tomorrow”.
ICoSeMT 2019 has covered recent developments in the following topics: Optical and Electronic Materials • Narrow and Wide Band Gap Semiconductors • Diamond, Graphene, and Carbon Nanotubes • Piezoelectric and Ferroelectric Materials • Electroluminescent Materials • Colour-Changing Materials • Energy Storage Materials • Dielectric Materials • Porous Structures • Nanostructures • Superconductors Organic and Polymeric Materials • Organic Semiconductors • Conductive Polymers • Polymer Electronics and Coatings • Polymer Catalysts and Characterization • Composite Polymers and Biopolymers • Functional Polymers and Polymer Hybrid Materials Devices • Optoelectronics • Sensors and Actuators • Power & Electronic Devices • Novel Devices • Photovoltaics • MEMS/NEMS • Contacts and Interconnects • Fabrication Processes • Integrated System Design • Modelling and Simulation Packaging Technology • Phosphor Technology • Lens and Optics • Thermal Management
• Front End Assembly Processes • Back End Processes and Applications • Failure Analysis and Reliability This journal issue contains selected papers from ICoSeMT2019 which are divided into 4 chapters.
We hope that this can offers readers and opportunity to access the recent advancements and developments for current and future directions of research especially in the fields of optical and electronic materials, devices, organic and polymeric materials and packaging technology.

Effect of High-Energy Ball-Milling and TiB2 Content on Microstructures and Properties of Cu-TiB2 Composites Sintered by SPS Dae-Hwan Kwona , Thuy Dang Nguyenb, Pyuck-Pa Choic, Ji-Soon Kim d and Young-Soon Kwone 1 School of Materials Science & Engineering, Research Center for Machine Parts and Materials Processing, University of Ulsan, San 29 Mugeo-dong, Nam-gu, Ulsan 680-749, Korea ahwan1972@korea.com, btnguyendang2000@yahoo.com, cppchoi@mail.ulsan.ac.kr, d jskim@mail.ulsan.ac.kr, eyskim@ulsan.ac.kr Keywords: high-energy ball-milling, cu-tib2 composites, spark-plasma sintering Abstract.
Introduction Copper and copper-based alloys are widely used as electric and electrode materials due to their good conductivity.
Experimental TiB2 (99.5%, <325mesh) and copper (99.5%, <325mesh) powders were used as raw materials.
Li : Journal of Materials Engineering Vol.10 (1995), p. 23
Onose : Journal of Nuclear Science and Technology Vol. 36(4) (1999), p. 380

Experimental Material and Treatments.
Journal of Wood Chemistry and Technology (2004), 24(2),p.169-181
Journal of Wood Chemistry and Technology (2004). 24(4), p.302-321
Journal of Pulp and Paper Science(1987), 13(5), p. 165-169
Tappi Journal (1995), 78(3), p.103-111.