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Online since: March 2016
Authors: Hong Xiang Yin, Xiao Gang Li, Hong Hong Zheng, Shao Heng Sun, Ai Min Zhao
Study of the Microstructure and Mechanical Properties of a Medium
Manganese Quenching and Partitioning (Q&P) Steel
Xiaogang Lia, Aimin Zhaob, Honghong Zhengc, Shaoheng Sund
and Hongxiang Yine
School of Engineering Research Institute, University of Science and Technology Beijing 100083, China
ali_xiaogang@126.com, baimin.zhao@ustb.edu.cn, czhenghonghong1988@126.com, dsunshaoheng@139.com, eyhxlloy1314920@yeah.net
Keywords: Medium-manganese steel, Q&P heat treatment, Retained austenite, Mechanical properties, Product of strength and plasticity.
As the third generation steel of AHSS (Advanced High Strength Steels), Q&P (Quenching and Partitioning) steel for automobile has a good combination of strength and plasticity.
Sc. i Forum, 2003, 426-432: 1089-1094
As the third generation steel of AHSS (Advanced High Strength Steels), Q&P (Quenching and Partitioning) steel for automobile has a good combination of strength and plasticity.
Sc. i Forum, 2003, 426-432: 1089-1094
Online since: August 2008
Authors: Hsiang Chen Hsu, Hui Yu Lee, Wen Lo Shieh
., Ta-Hsu Hsiang, Kaohsiung County, Taiwan
Department of Mechanical and Automation Engineering, I-Shou University, Taiwan
a
hchsu@isu.edu.tw,
b
tsubasa71128@yahoo.com.tw, cwenlo.shieh@msa.hinet.net
Keywords: CMOS Image Sensor, Thermal Cycle Test, Moiré Interferometry, JEDEC, Submodel
Scheme.
Introduction The advanced microelectronic packaging technology requires high I/O density to improve electrical performance and more effective thermal management to evaluate the reliability of the electronic package.
Special thanks to Manufacturing Engineers in Taiwan IC Package Corp. for their fully supports in this study.
Hung, "Reliability Prediction for 95.5Sn3.9Ag0.6Cu Solder Bump and Thermal Design for Lead Free System in Package with Polymer-Based Material", Material Science Forum, Vol. 505, pp.289-294, (2006)
Introduction The advanced microelectronic packaging technology requires high I/O density to improve electrical performance and more effective thermal management to evaluate the reliability of the electronic package.
Special thanks to Manufacturing Engineers in Taiwan IC Package Corp. for their fully supports in this study.
Hung, "Reliability Prediction for 95.5Sn3.9Ag0.6Cu Solder Bump and Thermal Design for Lead Free System in Package with Polymer-Based Material", Material Science Forum, Vol. 505, pp.289-294, (2006)
Online since: October 2014
Authors: Heng Chen, Wen Wei Jia
Evaluation index system and its weight on software scheme of sport E-government platform
Code
Name
Weight
Code
Name
Weight
U1
Information resources
0.18
U5
Project management
0.11
u11
Data integrity
0.35
u51
Work planning
0.19
u12
Data sharing
0.22
u52
Collaboration level
0.26
u13
Information quality
0.25
u53
Risk prevention
0.31
u14
Information application
0.28
u54
personnel training
0.24
U2
Online office
0.14
U6
Function Performance
0.15
u21
Document processing
0.41
u61
Functional integrity
0.33
u22
Internal affairs
0.16
u62
Reliable performance
0.29
u23
Auxiliary tools
0.11
u63
Easy maintenance
0.24
u24
Collaborative office
0.32
u64
Standard Generalized
0.14
U3
Portal site
0.16
U7
Cost effectiveness
0.12
u31
Website building
0.21
u71
Development costs
0.28
u32
Website design
0.29
u72
Operating costs
0.22
u33
Website content
0.31
u73
Direct benefit
0.12
u34
Website manufacture
0.19
u74
Indirect benefit
0.38
U4
Development technology
0.09
U8
Policy regulation
0.05
u41
Advanced
0.15
u81
Evaluation is the basis for decision-making is an important branch of systems engineering [8,9].
Yuan, "Comparison and Selection of Index Standardization Method in Linear Comprehensive Evaluation Model," Statistics & Information Forum, vol. 25, no. 8, pp. 10-15, 2010
Evaluation is the basis for decision-making is an important branch of systems engineering [8,9].
Yuan, "Comparison and Selection of Index Standardization Method in Linear Comprehensive Evaluation Model," Statistics & Information Forum, vol. 25, no. 8, pp. 10-15, 2010
Online since: July 2014
Authors: Yi Zhang Guo
Introduction
Modern commercial exhibition design is the use of advanced science and technology of human society and the modernization of the means of business management, the industrialization society production brought about by material conditions, through various media, to create visual effects and changeable, to complete a business media planning, and then with a new product idea to change the customer shopping the psychological, so that consumers under the display effect, organic option for commodity [1].
In addition, considering the overall display, and functional factors more important, including the topic, focus, balance, proportion, form, color, space planning, common practice, repetition effect, capacity planning and serialization and human engineering and some other principle.
Industry and Technology Forum, Vol.22 (2013), p.198-199
In addition, considering the overall display, and functional factors more important, including the topic, focus, balance, proportion, form, color, space planning, common practice, repetition effect, capacity planning and serialization and human engineering and some other principle.
Industry and Technology Forum, Vol.22 (2013), p.198-199
Online since: October 2010
Authors: Zheng Li, Bo Wen Cheng, Xu Pin Zhuang, Wei Min Kang
Acknowledgement
This work was supported by Tianjin Research Program of Application Foundation and Advanced Technology under Grant 10JCYBJC02700.
[4] Hong, K.H., Polymer Engineering & Science, Vol. 47 (2007), p. 43
[14] Struszczyk, H., Journal of Applied Polymer Science, Vol. 33 (1987), p.177 [15] Kang, W.M., et al., International Forum on Biomedical Textile Materials Proceedings, p.163 (2007) [16] Zhuang, X.P, Cheng, B.W, Kang, W.M and Xu, X.L.Vol.82 (2010), P. 524
[4] Hong, K.H., Polymer Engineering & Science, Vol. 47 (2007), p. 43
[14] Struszczyk, H., Journal of Applied Polymer Science, Vol. 33 (1987), p.177 [15] Kang, W.M., et al., International Forum on Biomedical Textile Materials Proceedings, p.163 (2007) [16] Zhuang, X.P, Cheng, B.W, Kang, W.M and Xu, X.L.Vol.82 (2010), P. 524
Online since: January 2012
Authors: De Yu Chen, Yue Qin Hang, Xiao Cheng Su, Xue Fang Zhu
Besides, this system, not only new but also advanced, has achieved good economic results.
References [1] Piccinini F.Quality control of screen printing media.Cfi-cerakic forum international [J].2005,82(12):E28 [2] ]Kiatkamjornwong,P Putthimai,H Noguchi.Comparison of textile print quality between inkjet and screen printings [J].Surface Coatings International Part B: Coatings Transactions,2005, 88( 1): 25– 34
Journal of Xi'an Institute of Engineering Science and Technology,2004,18(2):160-164.
References [1] Piccinini F.Quality control of screen printing media.Cfi-cerakic forum international [J].2005,82(12):E28 [2] ]Kiatkamjornwong,P Putthimai,H Noguchi.Comparison of textile print quality between inkjet and screen printings [J].Surface Coatings International Part B: Coatings Transactions,2005, 88( 1): 25– 34
Journal of Xi'an Institute of Engineering Science and Technology,2004,18(2):160-164.
Online since: March 2012
Authors: S.J. Chang, S.P. Chang, C.J. Chiu, W.Y. Weng
Chang
Institute of Microelectronics & Department of Electrical Engineering,
Center for Micro/Nano Science and Technology,
Advanced Optoelectronic Technology Center,
National Cheng Kung University, Tainan 70101, TAIWAN
achangsp@mail.ncku.edu.tw
Keywords: amorphous indium gallium zinc oxide (a-IGZO), Ta2O5, thin film transistor, nonvolatile memory
Abstract.
Forum Vol. 83-87 (1992), p. 119 [2] Y.
Forum Vol. 83-87 (1992), p. 119 [2] Y.
Online since: March 2004
Authors: Sang J. Lee, Chung Hyo Lee, S.Y. Chun, Joo Sun Kim, S.H. Lee
Kim2
1
Dept. of Advanced Materials Science & Engineering, Mokpo National University,
Muan 534-729, Korea
2
Research Center for Machine Parts and Materials Processing, University of Ulsan,
Ulsan 680-749, Korea
Keywords: Mechanical Alloying, Hematite, Solid State Reduction, Saturation Magnetization,
Ball Milling Energy, Positive Reaction Heat
Abstract.
Forum, Vol 88-90 (1992), p. 715 [7] G.G.
Forum, Vol 88-90 (1992), p. 715 [7] G.G.