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Online since: April 2023
Authors: B.K. Barakhtin, S.N. Perevislov, A.S. Zhukov, V.V. Madin, P.A. Kuznetcov
., Multistable Architected Materials for Trapping Elastic Strain Energy, Advanced Materials. 27, issue 29 (2015) 4296-4301
Qiu et al., Influence of processing conditions on strut structure and compressive properties of cellular lattice structures fabricated by selective laser melting, Materials Science & Engineering.
Kuznetcov et al., Energy absorbing properties of the cellular structures with different wall thickness, produced by the selective laser melting, Materials Science Forum. 933 (2018) 330-336
Qiu et al., Influence of processing conditions on strut structure and compressive properties of cellular lattice structures fabricated by selective laser melting, Materials Science & Engineering.
Kuznetcov et al., Energy absorbing properties of the cellular structures with different wall thickness, produced by the selective laser melting, Materials Science Forum. 933 (2018) 330-336
Online since: July 2022
Authors: Ghassan H. Mousa
Mousa
Department of Mechanical Engineering, King Abdulaziz University, Jeddah, KSA
Gmousa@kau.edu.sa
Keywords: Biomass, palm waste, power generation, environment, alternative power sources.
The advanced technology used in the biomass-to-power plants results in fewer emissions in the plant site.
Martani, Study on Utilization of Palm Frond for Wood Plastic Composite, Materials Science Forum Vol. 890 (2017) pp. 40–43
The advanced technology used in the biomass-to-power plants results in fewer emissions in the plant site.
Martani, Study on Utilization of Palm Frond for Wood Plastic Composite, Materials Science Forum Vol. 890 (2017) pp. 40–43
Online since: November 2016
Authors: Yuichi Ienaga
Kawamura, Application of Mixture Rule to Finite Element Analysis for Forging of Cast Mg-Zn-Y Alloys with Long Period Stacking Ordered Structure, Materials Science & Engineering A548 (2012) 75-82
Higashi, Development of new high-strength and heat-resistant Mg-Zn-Y-X (X = Zr and Ag) casting alloys, Materials Science Forum Vols. 783-786 (2014) pp. 384-389
[4] The Japan Magnesium Association ed., Handbook of Advanced Magnesium Technology, Kallos Publishing Co.
Higashi, Development of new high-strength and heat-resistant Mg-Zn-Y-X (X = Zr and Ag) casting alloys, Materials Science Forum Vols. 783-786 (2014) pp. 384-389
[4] The Japan Magnesium Association ed., Handbook of Advanced Magnesium Technology, Kallos Publishing Co.
Online since: May 2014
Authors: Li Qun Guo, Yan Qun Guo
Research on the Design of Green Building - Take Fragrance Hill Hotel for Example
Guo Liqun1,a and Guo Yanqun2,b
1Doctor Student in school of Art and Design,Wuhan University of Technology;The School of Arts and Design of Wuhan Institute of Technology,No.1 Special of Liufang Avenue, Jiangxia District , Wuhan 430205,China
2The School of Ellectronical and Information Engineering of Wuhan Institute of Technology,No.693 Xiongchu Avenue,Wuhan 430073,China
a46732899@qq.com, b664657115@qq.com
Keywords: Ieoh Ming Pei, Fragrant Hill Hotel, Green Building.
The traditional design culture is not developed; advanced technology is not applied, not to mention the Green Building.
The forum of Fragrant Hill Hotel.
The traditional design culture is not developed; advanced technology is not applied, not to mention the Green Building.
The forum of Fragrant Hill Hotel.
Online since: December 2006
Authors: Yong Tang, Zhen Ping Wan, Wen Jun Deng, Ya Jun Liu
Study on Process of Planing Forming of Plate Fin Heat Sinks
Zhenping Wan1,a, Yong Tang
1,b, Wenjun Deng1,c and Yajun Liu1,d
1
College of Mechanical Engineering, South China Univ. of Tech., Guangzhou 510640, China
a
zhpwan@scut.edu.cn, bytang@scut.edu.cn, cdengwj@scut.edu.cn, dyajun@scut.edu.cn
Keywords: IC Chip, Heat dissipation, Rough surface, Plate fin heat sinks, Planing, Chip curl
Abstract.
Introduction Driven by technical VLSI advances and new, power-hungry applications, the IC Chip is advancing at an ever-increasing pace.
Forum, Vol.471-472 (2004), pp.248-254
Introduction Driven by technical VLSI advances and new, power-hungry applications, the IC Chip is advancing at an ever-increasing pace.
Forum, Vol.471-472 (2004), pp.248-254
Online since: June 2014
Authors: Hong Yan Zhao, Jun Zhang, Jian Qiang Zhang
IETM Database Design Based on Native XML Database Technology
Jun Zhang 1, a, Janqiang Zhang 1,b , Hongyan Zhao 1,c
1Air Force Engineering University Xi'an City, Shaanxi Province, China. 710051
azhang-junn@163.com, czhjq110@163.com , bzyr392@sina.com
Keywords: IETM; Native XML databases; S1000D4; storage and indexing mode
Abstract.
Forum Vol. 83-87 (1992), p. 119 [2] M.A.
Mishing, in: Diffusion Processes in Advanced Technological Materials, edited by D.
Forum Vol. 83-87 (1992), p. 119 [2] M.A.
Mishing, in: Diffusion Processes in Advanced Technological Materials, edited by D.
Online since: February 2011
Authors: Xiao Lei Su, Chong Fu, Jun Bo Wang, Min Ge Yang, Xin Hai He, Jie Xu
Microstructure and Properties of La-Doped Ag-SnO2/Cu Contact Material
Chong Fua, Junbo Wangb, Minge Yangc, Xinhai Hed,
Xiaolei Sue and Jie Xuf
Mechanical and Electronic Engineering College, Xi’an Polytechnic University, Xi’an 710048, P R China
afuchong69@163.com, bwangjunbo@xpu.edu.cn, cyangminge2003@yahoo.com.cn, dhe_xinhai@163.com, esuxlei@163.com, fxu_jie@163.com
Keywords: Supersonic Plasma Spraying; Ag-SnO2; La-Doped; Mechanical Property; Electrical Conductivity
Abstract.
The advanced system developed by national key laboratory for remanufacturing of China, which has been described in detail elsewhere [12-14].
Forum Vol. 475-479 (2005), p. 3981 [13] X.
The advanced system developed by national key laboratory for remanufacturing of China, which has been described in detail elsewhere [12-14].
Forum Vol. 475-479 (2005), p. 3981 [13] X.
Online since: May 2012
Authors: Ling Xin Zhang, Jie Ping Liu, Kun Xia, Lin Dong
Analysis of Different Seismic Response between Low and High Stories of Buildings
XIA Kun 1, a, ZHANG Ling Xin 2,b, LIU Jie Ping 2,c and DONG Lin 1, d
1 Lanzhou Institute of Seismology, China Earthquake Administration, Lanzhou 730000, China
2 Institute of Engineering Mechanics, China Earthquake Administration, Harbin 150080, China
axiakunxiakun@163.com, blingxin_zhang@126.com, cnewlboy@126.com, daiai03201010408@sohu.com
Keywords: Effects on humans; Effects on objects; Seismic response analysis
Abstract.
References [1] Huohong Chen: MSC.Marc Advanced Course (China Machine Press, Beijing 2002)
Forum Vol. 7 (2004), p. 1~5
References [1] Huohong Chen: MSC.Marc Advanced Course (China Machine Press, Beijing 2002)
Forum Vol. 7 (2004), p. 1~5
Online since: April 2012
Authors: Wang Yue Yang, Zu Qing Sun, Long Fei Li
Dynamic Recrystallization of Ferrite in a Low Carbon Steel with the (α+θ) Duplex Microstructures
Li Longfei 1, a, Yang Wangyue 2,b and Sun Zuqing 1,c
1 The State Key Laboratory for Advanced Metals and Materials, University of Science and Technology Beijing, Beijing, 100083, P.R.China
2 School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing, 100083, P.R.China
alilf@skl.ustb.edu.cn, bwyyang@ ustb.edu.cn, czqsun@ustb.edu.cn
Keywords: low carbon steel, DRX, ferrite, cementite particles, PSN
Abstract: Dynamic recrystallization (DRX) of ferrite in a low carbon steel with the (α+θ) duplex microstructures was investigated using hot compression tests in combination with SEM, TEM and EBSD, and the effect of the size of cementite particles was analyzed.
Forum Vol. 558-559 (2007), p. 617 [9] F.J.
Forum Vol. 558-559 (2007), p. 617 [9] F.J.
Online since: September 2008
Authors: Xiao An Fu, Glenn M. Beheim, Philip G. Neudeck, Amita Patil, Steven Garverick, Mehran Mehregany
Garverick1,e, Mehran Mehregany
1,f
1
Department of Electrical Engineering and Computer Science
Case Western Reserve University, Cleveland, Ohio 44106, USA
2NASA Glenn Research Center, Cleveland, OH 44135, USA
a
xxf@case.edu, bamita@case.edu, cPhilip.G.Neudeck@nasa.gov, d
Glenn.M.Beheim@nasa.gov,
e
steven.garverick@case.edu, f
mehran@case.edu
Keywords: JFET, high temperature electronics, 6H-SiC, device physics, device fabrication
Abstract.
In addition, SiC fabrication technology is the most advanced among wide bandgap semiconductors suitable for operating temperature above 500o C [1]-[2].
Forum, 264-268 (1998), p. 1077
In addition, SiC fabrication technology is the most advanced among wide bandgap semiconductors suitable for operating temperature above 500o C [1]-[2].
Forum, 264-268 (1998), p. 1077