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Online since: February 2012
Authors: Yang Jian Ji, Guo Ning Qi, Yong Zhang, Peng Jiang, Li Wei Song
Although it has the simple operating principle, it is on the subject of mechanics, electrics, hydraulics and transferring energy, information and materials.
Part 6617838 and part 6617569 can be chose out respectively because of their different geometry or materials.
The Journal of Product Innovation Managemnet, Vol. 1 (1984) No. 2, p.85
Journal of the Petroleum University, Vol. 28(2004) No.2, p.85, in Chinese
Liu: Product Design and Development Based on DSM (Science Press, Beijing 2009), in Chinese.
Online since: January 2010
Authors: Udom Tipparach, Pichet Limsuwan
The harnessing of solar energy to convert sunlight to chemical energy in the form of hydrogen with the use of appropriate semiconductor materials has been a dream of scientists and technologists for many decades.
Sorrell, International Journal of Hydrogen Energy, 27 (2002) p. 991
Grimes, Solar Energy Materials & Solar Cells, 90, (2006) p. 2011. [5] S.I.
Misra, International Journal of Hydrogen Energy, 25 (2002) p. 495
Ingler Jr, Science, 297(2002) p. 2243.
Online since: January 2011
Authors: Bing Han, Shen Kui Liu, Xue Han
Therefore the use of botanical garden materials has certain restrictions.
The introduction of some plant materials from warm area, research of its cold resistance and making its live through the winter in Harbin has realistic significance.
Materials and methods Plant Material growth conditions Hosta undulate, Hosta plantaginea and Hosta plantaginea ‘Rosea’, planted in ShenYang city without aberrance for three years, were transported in plastic bags to the laboratory in Harbin.
Journal of Agro-Environment science. 1998, 40(2): 118~125 [4] Trenholm L.E., Dudeck A.E., Sartain J.B., Cisar J.L.
Crop Science. 1998, 38: 168-173 [5] Zhang JZH.
Online since: May 2011
Authors: Bing Yan Jiang, Lei Chen, Dai Bing Li, Stefan Kirchberg
Journal of Wuxi Institute of Commerce.
Journal of Transducer Technology.
Optoelectronic and Microelectronic Materials Devices.
Huazhong University of Science and Technology, 2008.
Materials Science Forum.
Online since: June 2015
Authors: Mai Woon Lee, Daniel C.S. Bien, Soo Kien Chen, Muhammad Aniq Shazni Mohammad Haniff, Au Shih Teh, Abdul Halim Shaari, Zainal Abidin Talib
Goswani, “Carbon nanotubes – Production and industrial applications,” Materials & Design, Vol. 28, pp. 1477-1489, 2007
Santucci, “Carbon nanotubes as new materials for gas sensing applications,” Journal of the European Ceramic Society, Vol. 24, No. 6, pp. 1405–1408, 2004
Yeow, “A review of carbon nanotubes-based gas sensors,” Journal of Sensors, Vol. 2009, Article ID 493904, 24 pages, 2009
Hash, “Carbon nanotube growth by PECVD: a review,” Plasma Sources Science Technology, Vol. 12, pp. 205–216, 2003
Lee, “Multiwalled carbon nanotube growth mechanism on conductive and non- conductive barriers,” Advanced Materials Research, Vol. 403-408, pp. 1201-1204, 2012
Online since: September 2013
Authors: De Ping Jiang, Zong Xiang Yao
Experimental Experimental materials for AZ71, AZ81, AZ91D magnesium alloy, rich cerium mischmetal (including Ce by about 55%, La and Nv mixture of about 40%, and a small amount of Pr).
The composition of raw materials are shown in table 1.
Recent development in light alloys [J].Materials transactions,JIM,1996,37(1):12~31
Effects of Rare Earth Additions and Solid Solution Treatment on Microstructure and Mechanical Properies of AM60B Magnesium Alloy..Materials Aterials For Mechanical Engineering,2003,27(2):21~24 [8] HUANG Xiao-feng,WANG Qu-dong,ZENG Xiao-qin.
Journal of Light Metal,Volume: 2, Issue: 4, 2002: 277~280
Online since: October 2009
Authors: Yu Dong Su, Shu Xiang Guo, Xiu Fen Ye
These smart materials include shape memory alloy (SMA), piezoelectricity, electroactive polymers (EAPs) and etc.
Ionic polymer metal composites (IPMC) is a kind of EAPs and a particularly promising class of actuator materials for underwater microrobots [2-7], since it produces large bending motions under low voltages (1 - 2 V), works well in water and other fluids, and is flexible and biocompatible.
Shahinpoor: Smart Materials and Structures. vol. 1(1992), no. 1, p. 91-94 [3] M.
Park: Smart Materials and Structures, vol. 14(2005), p. 1579-1585 [6] Xiufen Ye, Baofeng Gao, Shuxiang Guo and Liquan Wang: The International Journal of Automation and Computing, Springer Science Press.
Vol.3 (2006), No. 4, p.382-391 [7] Shuxiang Guo, Yuya Okuda, Wei Zhang, Xiufen Ye, Kinji Asaka: Journal of Applied Bionics and Biomechanics.
Online since: October 2010
Authors: Jia Lu Li, Guang Wei Chen
When assembling these pieces of mold together, sealing materials will put into the sealing slots to keep resin not leaking.
References [1] Bogdanovich, A.E., Mohamed, M.H.: SAMPE Journal, 45(2009), p. 8 [2] M.
Materials: Design and Applications, (2004), p. 253 [3] T.
Ko: Textile Structure Composites(Elsevier Science Publishers 1989) [4] Kang Tea Jin, Kim Sungjun, Jung Kyungho: Textile Research Journal, 78(2008), p. 922 [5] Kim K.J., Yu W.
-R., Lee, J.S.: International Journal of Material Forming, 1 (2008), p. 883 [6] Alexander E.
Online since: September 2013
Authors: Rajendaran Vairavan, Ong Tee Say, Vithyacharan Retnasamy, Zaliman Sauli, Phaklen Ehkan, Fairul Afzal Ahmad Fuad
Solder alloy materials have high melting points thus making their mechanical properties to be less affected by temperature.
The materials additional for the solder were estimated like elastic materials and the property are listed in Table 3.
Table 2 .Linear Elastic Material Properties For BGA Assemblies Materials Young’s modulus (GPa) Poisson’s ratio Density (kg/m3) Sn-3.9Ag-0.6Cu 52 0.35 7500 Cu 117 0.34 8900 FR4 172 0.39 1900 Fig1.
Kim, et al., "Failure behaviors of BGA solder joints under various loading conditions of high-speed shear test", Journal of Materials Science: Materials in Electronics, vol. 20, pp. 17-24, 2009
,“Shear ram speed characterization for copper wire bond shear test”, Applied Mechanics and Materials, Vols. 229-231, pp 670-673, 2012
Online since: February 2012
Authors: Yin Xia Chang, Si Xiang Zhang, Jian Yi Li
There are two ways can be done: using the materials with higher dielectric constant K and the reduction of the dielectric layer thickness.
In the Duke patent application, the PCB chip production step includes[12]: 1) Select common PCB board as a substrate; 2) Pattern the outermost conductive copper layer of PCB to form electrodes; 3) Using solder mask material (or other dielectric materials) to insulate the electrode; 4) As an alternative procedure, single-step hydrophobic layer can be applied to PCB, in order to promote droplet transmission.
Journal of Tsinghua University: Science and Technology,2006,46(7):1341-1344
Journal of Applied physics, 2002, 92: 4080- 4087
Journal of Fudan University: Natural Science, 2010,4: 185-189