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Online since: June 2020
Authors: Rosdi Daud, M.M. Mustaqieem, A. Shah, Andril Arafat, M. S. Dambatta, Hassan Mas Ayu
Dambatta4,f 1Faculty of Mechanical and Automotive Engineering Technology, Universiti Malaysia Pahang, 26600 Pekan, Pahang, Malaysia 2Faculty of Technical and Vocational, Universiti Pendidikan Sultan Idris, 35900 Tanjong Malim, Perak, Malaysia 3Department of Mechanical Engineering, Faculty of Engineering, Universitas Negeri Padang, 25131, Air Tawar Padang, Sumatera Barat, Indonesia 4Department of Mechanical Engineering, Faculty of Engineering, Kano University of Science and Technology Wudil, P.
The authors also would like to acknowledge Faculty of Mechanical Engineering, Universiti Teknologi Malaysia for providing their facilities in conducting this research.
Journal of Genetic Engineering and Biotechnology, 2011. 9: p. 77-82
Materials Science Forum, 2018. 916: p. 153-160
Advances in Engineering Software, 2006. 10(37): p. 649-658.
Online since: August 2017
Authors: Vladimir Luzin, Chris M. Wensrich, Oliver Kirstein, Erich H. Kisi, Alexander L. Smith, Jian Feng Zhang
Background Granular materials are ubiquitous in both nature and engineering as the most dominant form of matter on the surface of the planet.
The mechanics of these materials is complex, having properties that span the range of solids, liquids and gases depending on the situation [1]; they can resist large loads as foundations for civil engineering structures, be poured from a container like a liquid or act like a gas when fluidised (e.g. [2,3]).
Chemical Engineering Science Vol. 45(11) (1990), p. 3233-3245
Kolymbas: Introduction to Hypoplasticity: Advances in Geotechnical Engineering and Tunnelling 1 (Vol. 1).
Kirstein: Stress distribution in iron powder during die compaction, Material Science Forum Vol. 777 (2014), p. 243-248
Online since: September 2013
Authors: Emmanuelle Rouhaud, Pierre Renaud, Jawad Badreddine, Matthieu Micoulaut, Sebastien Remy, Vincent Desfontaine
François, “Granular gases in mechanical engineering: on the origin of heterogeneous ultrasonic shot peening,” Granular Matter, vol. 9, pp. pp. 25-33, Aug. 2007
J., “Modelling of ultrasonic shot peening process,” Materials Science Forum, vol. 490–491, pp. 67-72, 2005
Lévesque, “On the potential applications of a 3D random finite element model for the simulation of shot peening,” Advances in Engineering Software, vol. 40, no. 10, pp. pp. 1023-1038, Oct. 2009
Dogui, “Finite element modelling of shot peening process: Prediction of the compressive residual stresses, the plastic deformations and the surface integrity,” Materials Science and Engineering: A, vol. 426, no. 1–2, pp. 173-180, Jun. 2006
Online since: January 2019
Authors: Yun Kai Li, Wen Kai Chen, Yi Wen Chen
High Compressibility ZrTiHfV0.5Nb0.5CX Refractory High-Entropy Alloys Wenkai Chen1,2,a, Yunkai Li 1,2,b* and Yiwen Chen 1,2 1School Materials Science and Engineering, Beijing Institute of Technology, Beijing 100081, China 2 National Key Laboratory of Impact Environment Materials Technology a1009795205@qq.com, bliyunkai@bit.edu.cn Keywords: Refractory high-entropy alloy; carbon composite; microstructure; mechanical properties Abstract.
Phase analysis are tested by German Bruker AXS D8 advance X-ray diffractometer (Cu-Kα, λ=0.15418 nm, scanning speed 5°/min, scanning range: 20°~90°).
Materials Science Forum, 560, 1-9
Materials Science & Engineering A 712(2017)
Rare Metal Materials & Engineering, 42(2), 232-237
Online since: September 2019
Authors: Margarita Aleksandrovna Skotnikova, Nikolay Alexandrovich Krylov, Evgeniy Konstantinovich Ivanov, Viktoria Valerevna Medvedeva, Ilnur Salavatovich Syundyukov, Jiang Da Qian
In Advances in Mechanical Engineering 2018 (pp. 53-60).
Research of base and alloyed oil MC-20 influence on the tribotechnical characteristics of roller bearings // Bialystok university of technology, faculty of mechanical engineering.
InMaterials Science Forum 2013 (Vol. 762, pp. 116-121).
InAdvances in Mechanical Engineering 2017 (pp. 37-44).
Online since: May 2012
Authors: Chin Che Tin, Zhe Chuan Feng, Chee Wee Liu, Ling Yun Jang, Kung Yen Lee, Zhi Ren Qiu, Zhengyun Wu, Suwan P. Mendis, Qiang Xu, Cheng Chen
Mendis4,d, Ling-Yun Jang5,e, Chin-Che Tin4,f, Kung-Yen Lee6,g,#, Chee Wee Liu1,7,h, Zhengyun Wu3,i, and Zhi Ren Qiu2,j,+ 1Institute of Photonics & Optoelectronics and Department of Electrical Engineering, National Taiwan University, Taipei, 106-17 Taiwan 2State Key Laboratory of Optoelectronic Materials and Technologies and School of Physics and Engineering, Sun Yat-Sen University, Guangzhou, 510275 China 3Department of Physics, Xiamen University, Xiamen 361005, China 4Department of Physics, Auburn University, Auburn, AL 36849, USA 5National Synchrotron Radiation Research Center, Hsinchu, 30076 Taiwan 6Department of Engineering Science and Ocean Engineering, National Taiwan University, Taipei, 106-17 Taiwan 7National Nano Device Laboratories, Science-based Industrial Park, Hsinchu, 30078 Taiwan afengzc@cc.ee.ntu.edu.tw, bynu2008@163.com, cxuqiang-1322@163.com, dmendisp@auburn.edu, elyjang@nsrrc.org.tw, ftinchin@auburn.edu, gkylee@ntu.edu.tw, hcheeweeliu@gmail.com, izhywu@xmu.edu.cn
Pensl (Eds.), Silicon Carbide: Recent Major Advances, Springer, Berlin, 2004
Forum 645-648 (2010) 443
Feng, Microelectronic Engineering 83 (2006) 165
Online since: January 2014
Authors: Feng Xing, Liang Liang Wei, Ji Hua Zhu, Wei Wen Li, Miao Chang Zhu
Experimental Study of Bond Behavior on Aluminum Alloy Plate-to-Concrete Interface Ji-Hua Zhu1,a Liangliang Wei1 Miaochang Zhu1 Weiwen Li1 and Feng Xing1 1College of Civil Engineering, Guangdong Key Laboratory on Durability for Marine Civil Engineering, Shenzhen University, Shenzhen, China a.
Chen and Teng [5, 6] suggested simplified bilinear bond strength-slip model which is more suitable for engineering applications.
Engineering Structures 24 .385–395. (2002)
Engineering Structures 26. 553–565. (2004)
In: Proceedings of the third international forum on advances in structural engineering.
Online since: June 2017
Authors: Sato Hiroyuki
Extrapolation of Imaginal Minimum Creep Rate in Compression by a Concept of SATO-Index Hiroyuki Sato 1 * 1 Department of Mechanical Science and Engineering, Hirosaki University, 3 Bunkyo, Hirosaki, Aomori, 036-8561 JAPAN g4sato@hirosaki-u.ac.jp Keywords: Creep Curve, Extrapolation, Primary Creep, High Temperature Deformation Abstract.
However, in engineering heat resistant alloys for example, the steady-state creep rate is not always observed, thus the minimum creep rate is treated as a representative value.
Sato.: Materials Science Forum, 794-796 (2014), PP 307-312
[7] Hiroyuki Sato et al., Key Engineering Materials, 592-593(2013), 606-609 [8] R.W.
Evans, et. al., Recent Advances in Creep and Fracture of Engineering Materials and Structures, Ed. by B.
Online since: September 2013
Authors: Alexander Ryabchikov, Harri Lille, Jaak Valgur, Jakub Kõo, Renno Reitsnik, Renno Veinthal
Veinthal2,f 1Institute of Forestry and Rural Engineering, Estonian University of Life Sciences, Kreutzwaldi 5, 51014 Tartu, Estonia 2Department of Materials Engineering, Tallinn University of Technology, Ehitajate tee 5, 19086 Tallinn, Estonia aharri.lille@emu.ee (corresponding author), bjakub.koo@emu.ee, cjaak.valgur@emu.ee, dalexander.ryabchikov@emu.ee, erenno.reitsnik@emu.ee, frenno.veinthal@ttu.ee Keywords: thermo-bimetal, layer removing, curvature method, hole-drilling technique, residual stresses Abstract.
Valgur, Residual Stress Determination in Plates Using Layer Growing/Removing Method, in Experimental Mechanics, Advances in Design, Testing and Analysis, Proc. of the 11th Int.
Valgur, Residual Stress Measurement in Coated Plates Using Layer Growing/ Removing Methods: 100th Anniversary of the Publication of Stoney’s Paper “The Tension of Metallic Films Deposited by Electrolysis”, Materials Science Forum 681 (2011) 165-170
Conf. of DAAAM Baltic Industrial Engineering (Kyttner, R., ed), Estonia, 2008, 485-490
Rasty, Influence of Drilling Parameters on the Accuracy of Hole-drilling Residual Stress Measurements, in Engineering Applications of Residual Stresses, Conference Proceedings of the Society for Experimental Mechanics Series 999 (T.
Online since: November 2012
Authors: Y. Varthamanan, V. Kannan
A number of phenomenal advances in CMOS technology by many luminaries in the semiconductor device field.
He received his Bachelor Degree in Electronics and Communication Engineering from Anna University, Chennai in the year 2004, Master Degree in Applied Electronics from Sathyabama University in the year 2007.
He is working as Assistant Professor in Department of ECE in Jeppiaar Engineering College, Chennai.
He received his Bachelor Degree in Electronics and Communication Engineering from Madurai Kamaraj University in the year1991, Masters Degree in Electronics and control from BITS, Pilani in the year 1996 and Ph.D., from Sathyabama University, Chennai, in the year 2006.
[4] Dafeng Zhou, Tom J Kazmierski and Bashir M Al-Hashimi, VHDL-AMS implementation of a numerical ballistic CNT model for logic circuit simulation - In IEEE Forum on Specification and Design Languages 2008, Southampton, SO17 1BJ, UK, 2008
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