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Problem of thermal management in electronic devices was studied experimentally by Tan and Tso [3] and numerically by Wang et al. [4].
Wang et al. [4] studied numerical model of PCM-base heat sinks.
El Qarnia, A.

El-Dessouky, Feord et al., Buerkholz, Belden, Bhatia, Tennyson, Holmes and Chen, Zhao et al. are amongst a few who have studied demister conceptually and experimentally.

Based on low-cycle accumulation damage proposed by Miner, the reduction factor R is introduced and can be given by ( ) 1 1 C � i f i R �     = −     ∑ (2) where, f� is the number of complete cycles to fatigue, which can be computed through low-cycle damage model developed by Kunnath et al.[3]; � is the number of half-cycle; C is assumed to be 0.5 to represent the rapid increase in the low-cycle accumulation damage as the number of cycles increases.
(1) Deformation damage component Dδ The deformation damage is generated by the maximum deformation experienced by members, in order to consider the loading history very well, the deformation damage model developed by Usami and Kumar et al. is adopted inhere [2], it is given by 1 max, 1 c � j y j u y Dδ δ δ δ δ=  − =    −  ∑ (6) where, 1� is the number of half cycles producing max, jδ for the first time; uδ is ultimate deformation under a constant axial load and monotonic lateral load; yδ is yield deformation; c =1 is parametric constant.
K., EL-Bahy, A,.

Lei Zhao et al [6] studied the self-assembly behavior of PS-PLA.
Synthesis of poly vinylbenzyl chloride-polylactide (PVBC-PLA) Ho et al reported the synthesis of polystyrene polylactide [10].
Schrock and E.L.

The element analysis ，conductivity of synthesized compound were recorded on Vario EL Ⅲ type element analyzer and SDTQ600V80Build95 TA thermal analyzer respectively.
References [1] Kwak B, Rhee H, Park S, et al.
Das et al.

Slaviša Putić et. al investigates the influence of structure, a reinforcement type and a sort of resin exert upon the interlaminar strength of glass fibre reinforced polyester composites.
Wang et. al studied the effects of accelerated ageing on the durability of glass fibre reinforced polyester resin through ILSS, tensile and bending tests [8].
El-baky, Composites: Part B 2012, 43, 1714

Nouari M. et al. [3] provided necessary information about the main factors affecting the hole quality i.e. cutting speed, temperature, feed rate, geometrical parameters as well as the influence of the cutting conditions and the temperature on the tool life in drilling.
Enemuoh et al, [4] studied new comprehensive approach to select cutting parameters for damage-free drilling in carbon fibre reinforced epoxy composite material.
Sherif El-Gizawy, A.Chukwujekwu Okafor “An approach for development of damage-free drilling of carbon fiber reinforced thermosets”, International Journal of Machine Tools & Manufacture 41 (2001) pp.1795–1814

El-Sayed, Double Oxide Film Defects and Mechanical Properties in Aluminium Alloys, University of Birmingham, Birmingham, UK, 2012
[3] Ludwig, T.H., et al., Influence of oxide additions on the porosity development and mechanical properties of A356 aluminium alloy castings.
[5] N., Green and J., Campbell, “Influence of oxide film filling defects on the strength of Al-7Si-Mg alloy castings,” AFS Transactions,102 (1994) 341–347

After cooling and tabletting , we got the glass sample. 2.2 X-ray photoelectron spectroscopy (XPS) measurements Core level photoelectron spectra were collected on a ThermoFisher Scientific ESCALAB 250 spectrometer using Al Kα radiation (hν = 1486.6 eV) from an anode operated at 130 W with a base pressure of 2×10-9Pa.
Zhongnan University,2011 [2] He Wei,Jiang Hong,Li Changjiu, et al. 
El-Batal, I.

After Wenchuan earthquake, Yu haiying at el have tested major strong motion seismographs samples triggered during the quake and confirmed their reliability [8].
(in Chinese) [3] Wang W M, Zhao L F, Li J, et al.
Journal of Seismology, 2010, 14(3): 195~504 [8] Yu H Y, Jiang W X, Xie Q C, et al.
Am., 2003, 93(2):674-693 [11] Li X J, Zhou Z H, Yu H Y et al.
Vib, 2008, 7(3): 235~246 [12] Xu X W, Wen X Z, YE J Q, et al.