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Materials Science Forum Vols. *** (2004) pp.498-502 online at http://scientific.net  2004 Trans Tech Publications, Switzerland Wrinkling Limit Based on FEM Virtual Experiment During NC Bending Process of Thin-walled Tube H.
Gu 1,b 1Department of Materials Forming and Control Engineering, Northwestern Polytechnical University, P.O.Box 542, Xi'an, 710072, P.R.China a seeplan@163.com, byanghe@nwpu.edu.cn, cm_zhan@sina.com Keywords: Wrinkling, Wrinkling limit, FEM, Thin-walled tube, NC bending Abstract.
So research on wrinkling and wrinkling limit has become a difficult and key problem in the R&D of the advanced process at present.
where 00/d t is the relative tube diameter， n is the strain hardening exponent, c is the clearance between tube and wiper die, aµ is the friction factor between tube and wiper die and bµ is the friction (1) Materials Science Forum Vols. *** 499 factor between tube and mandrel.
Also, decreasing relative diameter and increasing the strain hardening exponent could improve the forming limit of the advanced process.

Textures in multi-directional forged Mg by neutron diffraction Weimin Gan1, a, Heinz-Guenter Brokmeier2, b, Mingyi Zheng3, c and Kun Wu3 1GKSS Out Station at FRM-II, Lichtenberg strasse 1, D-85747 Garching, Germany 2Institute of Materials Science and Engineering, Clausthal University of Technology, Argicolastrasse 6, D-38678 Clausthal-Zellerfeld, Germany 3School of Materials Science & Engineering, Harbin Institute of Technology, 150001 Harbin, China aweimin.gan@gkss.de, bheinz-guenter.brokmeier@gkss.de, czhenghe@hit.edu.cn Keywords: texture, MDF, Mg, neutron diffraction Abstract.
Texture evolution in the MDF processed ZK60 along forging axis was investigated by advanced neutron diffraction.
Forum Vol. 488-489 (2005), p. 597
Forum Vol. 524-525 (2006), p. 211

Novel Advanced Analytical Design Tool for 4H-SiC VDMOSFET Devices L.
Rubino1,e 1 Department of Industrial Engineering, University of Salerno, Italy 2 Fraunhofer Institute for Integrated Systems and Device Technology (IISB), Germany aldibenedetto@unisa.it, bgdlicciardo@unisa.it, ctobias.erlbacher@iisb.fraunhofer.de, danton.bauer@iisb.fraunhofer.de, earubino@unisa.it Keywords: Power MOSFETs, Design methodology, Semiconductor device modeling, Power devices.
Forum, 821–823 (2015) 701−704
Forum, 778–780 (2014) 903–906.

Materials Science Forum Vols. *** (2004) pp.405-408 online at http://scientific.net  2004 Trans Tech Publications, Switzerland Studies on Exploiting Further the Potential of High Efficiency Grinding Y.C.
Sun 2,a 1 College of Mechanical and Electrical Engineering, Nanjing University of Aeronautics and Astronautics, Nanjing, China, 210016 2 College of Mechanical Engineering, Shanghai Jiaotong University, Shanghai, China, 200030 a yucanfu@nuaa.edu.cn Keywords: High efficiency grinding, Grinding wheel topography, Optimization, Grinding contact zone, Enhancing heat transfer Abstract.
The optimization model advanced here can be used to optimize the grinding wheel topography for different grinding processes with the minimum specific grinding energy.
Since expect for the speed, such factors as the structure of the wheel (slotted or Advances in Materials Manufacturing Science and Technology 406 not), the grinding wheel topography and machining parameters combination may have remarkable influence to the specific grinding energy.
Therefore a new idea of optimization designing the wheel topography in accordance with machining demands and machining parameters is advanced in this paper.

Forum 778-780 (2014) 75-78
Janzén, Current status and advances in the growth of SiC, Diamond Relat.
Forum 679-680 (2011) 28-31
Forum 740-742 (2013) 15-18
Ujihara, Current advances in SiC solution growth, Jpn, J.

Materials Science Forum Vols. *** (2004) pp.563-567 online at http://scientific.net  2004 Trans Tech Publications, Switzerland Simulation Diagnosis for the Bottleneck of Production Lines and It's Application J.
Deng 1,d 1 School of Mechanical Engineering, Shandong University, Jinan, 250061, Shandong Province, P.
Virtual Manufacturing Technology (VMT) is an integrative technology based on computer simulation, modeling, computer graphics, artificial intelligence, concurrent engineering, and multimedia technologies, which combines the design and manufacturing process in the three-dimensional and dynamic environment.
It consists the following advanced technologies: such as VMT, data management which is used for model database management, Object-Oriented modeling which is applied to system modeling as well as other advanced technologies.
Materials Science Forum Vols. *** 565 Optimal production line schemes also can be saved into case database under all sorts of conditions.

Preface We are delighted to invite you to participate 2011 International Conference on Advanced Materials and Computer Science (ICAMCS 2011) on May 1-2 , 2011, Chengdu, China Chengdu is a beautiful city, she has become a Landscape garden so the appearance of financial research, scientific and tourism services in the integration of multiple garden.
The objective of ICAMCS 2011 is to provide a forum for researchers, educators, engineers, and government officials involved in the general areas of Advanced Materials and Computer Science to disseminate their latest research results and exchange views on the future research directions of these fields. 2011 International Conference on Advanced Materials and Computer Science (ICAMCS 2011) is co-sponsored by Intelligent Information Technology Application Research Association, Southern Illinoic Univetsity Carbondale and National University of Singapore.
The mission is to bring together innovative academics and industrial experts in the field of Advanced Materials and Computer Science.
The conference will bring together leading researchers, engineers and scientists in the domain of interest.

References [1] Min You, Lu Lu Zhang, Zheng Peng Gong, et al, On the Properties of Conductive Adhesive Filled with Electroless Silver Plated Flake Graphite, Key Engineering Materials. 373(2008) 220-223 [2] Y.C Chan, D.Y Luk, Effects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects for flip-chip-on-flex packages assembly II.
Kumar, Recent advances in isotropic conductive adhesives for electronics packaging applications, International Journal of Adhesion and Adhesives. 18(1995), 362-371 [5] Jong Min Kim, K.C.
Yang, et al, Effect of Post Weld Heat Treatment on the Interface Microstructure of Explosively Welded Titanium/Stainless Steel Composite Clad, Materials Science Forum. 580(2008), 29-32 [6] Jagt, J.C, Reliability of electrically conductive adhesive joints for surface mount applications: a summary of the state of the art, Packaging, and Manufacturing Technology. 26(2005), 215-225 [7] Rui Ming Yin et al, Finite-Time Stabilization for Singular Linear Time-Delay Systems with Time-Varying Exogenous Disturbance, Advanced Materials Research. 490(2012), 2459-2463 [8] Shu Quan Liang, Yan Tang, et al, Negative Synergism between Corrosion and Wear of Nickel-Free Austenitic Stainless Steel in Artificial Body Solution, Materials Science Forum. 610(2009), 1183-1187 [9] Yong De Hao et al, Crystal, Electronic and Magnetic Structure of Co and Ag Doped Rutile TiO2 from First-Principles Calculations, Advanced Materials Research. 399(2011), 1789-1792

AMTS 2012 is an annual international forum for dissemination of original ideas and research results in advanced manufacturing technology and systems.
A major goal and feature of AMTS 2012 is to bring academic scientists, engineers, industry researchers together to exchange and share their experiences and research results about most aspects of advanced manufacturing technology and systems, and discuss the practical challenges encountered and the solutions adopted.

Introduction Recent advances made towards the improvement of the quality of 4H-SiC crystals have enabled successful applications in the power device industry.
This research used resources of the Advanced Photon Source, a U.S.
Forum 717-720 (2012) 477
Forum 717-720 (2011) 343
Forum 600-603 (2009) 305