Electronic Failure Analysis of Plate-Capacitors Bonding with Conductive Adhesives

Abstract:

The long-term stability of microelectronic devices is crucial for their practical applications. However, silver particles in the conductive adhesive can migrate easily under certain conditions, resulting in failure of the devices. In this investigation, the migration of silver particles has been studied by using the devices of Plate-capacitors in the cavity that are bonded with conductive adhesives. The experimental results show that the migration of silver particles occurred in the condition of humid environment with an applied direct current (DC) electric field. Also, the migration of silver particles under a variety of humidity was analyzed, and the reasons causing the failure of the devices were demonstrated.

• Periodical: Materials Science Forum (Volume 788)
• Pages: 569-572
• DOI: https://doi.org/10.4028/www.scientific.net/MSF.788.569
• Online since: April 2014
• Authors: Zhi Ming Song, Hong Wei Li, Bin Wang, Qian Tao Cao, Ying Lu Hu, Qiang Zhang
• Keywords: Conductive Adhesives, Electronic Failure, Microelectronic Assembly Process, Silver Particles

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