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Journal of Materials Engineering. 2014, 12: 86-91
Development on surface modification technology of advanced shot peening [J].
Tool Engineering. 2016, 50 (11): 48-50
Materials Science Forum. 2014, 788: 531-537.

Process optimization for Milling Deformation Control of Titanium Alloy Thin-walled Web Xu Ding1,a, Tingting Chen2,b, Yinfei Yang3,c and Liang Li4,d * College of Mechanical & Electrical Engineering, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China a798148655@qq.com, bchenting@nuaa.edu.cn, cyyfgoat@nuaa.edu.cn, dliliang@nuaa.edu.cn Keywords: Ti6Al4V titanium alloy, thin-walled Web, milling deformation, process optimization Abstract.
Chen, FEM-based Prediction and Control of Milling Deformation for a Thin-wall Web of Ti-6Al-4V Alloy, Materials Science Forum. 800 (2014) 368-373
He, Experimental study in high speed milling of titanium alloy TC21, The International Journal of Advanced Manufacturing Technology. 64 (2013) 49-54
He, The research on the control of machining deformation for thin-walled web, China Mechanical Engineering. 08 (2004) 14-18.

1.5 kV Lateral Double RESURF MOSFETs on 4H-SiC (000-1)C Face Masato Noborio1,a, Jun Suda1,b and Tsunenobu Kimoto1-2,c 1 Department of Electronic Science and Engineering, Kyoto University A1-303 Kyotodaigaku-katsura, Nishikyo, Kyoto, 615-8510 Japan 2 Photonics and Electronics Science and Engineering Center (PESEC), Kyoto University a noborio@semicon.kuee.kyoto-u.ac.jp, bsuda@kuee.kyoto-u.ac.jp, ckimoto@kuee.kyoto-u.ac.jp Keywords: MOSFET, reduced surface field (RESURF), breakdown voltage, on-resistance, lateral power device Abstract.
Introduction SiC lateral MOSFETs are the key devices to realize high-voltage power ICs in advanced electronic systems [1].
Forum Vols. 433-436 (2003), p. 753 [5] T.

Saddow2,6,g* 1NeuroNexus, LLC, Ann Arbor, MI, USA 2Dept. of Electrical Engineering Dept., University of South Florida, Tampa, FL, USA 3Dept. of Mechanical Engineering, University of South Florida, Tampa, FL, USA 4IMM-CNR, Catania, Sicily, IT 5 Moffitt Cancer Center, Tampa, FL, USA 6Dept. of Medical Engineering, University of South Florida, Tampa, FL, USA acfrewin@neuronexus.com, bbeygi.mohamad@gmail.com, cevans.bernardin@outlook.com, dchenyinfeng@usf.edu, efrancesco.lavia@imm.cnr.it, fWilliam.DominguezViqueira@moffitt.org, gsaddow@usf.edu Keywords: Neural Interface, Brain Implants, SiC biomedical, MEMS Abstract.
Single-crystal silicon carbide: A biocompatible and hemocompatible semiconductor for advanced biomedical applications.
Materials Science Forum (Vol. 679, pp. 824-830).
Annual Review of Biomedical Engineering, 11, 1-24. ].
E., Silicon Carbide Biotechnology: A Biocompatible Semiconductor for Advanced Biomedical Devices and Applications.

. – The 7th International Forum on Strategic Technology (IFOST 2012)  “Innovative technology and advanced engineering”, IFOST conference, September 17-21 (2012) 147-151
Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture, 228, 2 (2014) 191-202 [3].

Advances in Level-Set modeling of recrystallization at the polycrystal scale - Development of the Digi-µ software Benjamin SCHOLTES1,2,a, Modesar SHAKOOR1,b, Nathalie BOZZOLO1,c, Pierre-Olivier BOUCHARD1,d, Amico SETTEFRATI2,e and Marc BERNACKI1,f 1MINES ParisTech, PSL Research University, CEMEF - Centre de mise en forme des matériaux, CNRS UMR 7635, CS 10207 rue Claude Daunesse 06904 Sophia Antipolis Cedex, France 2Transvalor SA, 694 Avenue Docteur Maurice Donat, 06250 Mougins, France abenjamin.scholtes@mines-paristech.fr, bmodesar.shakoor@mines-paristech.fr, cnathalie.bozzolo@mines-paristech.fr, d.pierre-olivier.bouchard@mines-paristech.fr, eamico.settefrati@transvalor.com, fmarc.bernacki@mines-paristech.fr Keywords: Level-Set, recrystallization, grain growth, full field modeling.
Modelling and Simulation in Materials Science and Engineering 17 (2009), p. 064006
Materials Science Forum 753 (2013), pp. 113-116
Materials Science and Engineering: A 597 (2014), pp. 295-303
Computer Methods in Applied Mechanics and Engineering 268 (2014), pp. 65-81

Ramadan2,d 1 Department of Mechanical Engineering, University of Oulu, Box 4200, FIN-90014 University of Oulu, Finland 2 Department of Metallurgy & Materials Engineering, Suez Canal University, Box 43721, Salah Nassiem str., Suez City, Egypt a atef.hamada@oulu.fi, bpentti.karjalainen@oulu.fi, cmahesh.somani@oulu.fi d rashadrmdn@yahoo.co.uk Keywords: Fe-Mn-Al alloys, TWIP steels, hot deformation, dynamic recrystallisation, stacking fault energy, mechanical twinning, strength, ductility Abstract.
These efforts have led to growing demands for advanced high-strength steel sheets with excellent ductility.
True stress-strain curves (a) and engineering mechanical properties (b) of the steels at temperatures from -80°C to100°C.
Forum Vol. 500-501 (2005), p. 97 [4] Y.

Video Redirection Parameters Optimization Based on Hierarchical Genetic Optimization Strategy Song Jinbao 1, a, Ye Long 2,b , Zhang Qin 3,c , Chai Jianping 4,d 1 School of Information Engineering, Communication University of China, Beijing, China 2 Key Laboratory of Media Audio & Video, Ministry of Education, Communication University of China, Beijing, China 3 Key Laboratory of Media Audio & Video, Ministry of Education, Communication University of China, Beijing, China 4Faculty of Science and Techonology, Communication University of China, Beijing, China asongjinbao@cuc.edu.cn, b yelong@cuc.edu.cn, czhangqin@cuc.edu.cn, djp_chai@sina.com Keywords: Video Redirection; Image Tracking; Genetic Algorithm; Local Crossover; Hierarchical Mutation Abstract.
[3] Haiyan Li, Qingjie Sun, Xiaodan Liu, Qin Zhang, Example-based Stylized Trajectory Synthesis of Falling Leaf, 2010 International Conference on Computer Engineering and Technology, Chengdu, China
Advanced Engineering Forum Vols.6-7,September,2012,1066-1071

Incremental ECAP as a Method to Produce Ultrafine Grained Aluminium Plates Malgorzata LEWANDOWSKA1,a *, Witold CHROMINSKI1,b, Marta LIPINSKA1,c, Lech OLEJNIK2,d and Andrzej ROSOCHOWSKI3,e 1 Warsaw University of Technology, Faculty of Materials Science and Engineering, Woloska 141, 02-507 Warsaw, Poland 2 Warsaw University of Technology, Institute of Manufacturing Processes, Narbutta 85, 02-524 Warsaw, Poland 3 Design, Manufacture and Engineering Management, University of Strathclyde, 75 Montrose Street, Glasgow G1 1XJ, United Kingdom amalew@inmat.pw.edu.pl, bwichr@inmat.pw.edu.pl, c marta.lipinska@inmat.pw.edu.pl, dlechole@polnet.pl, ea.rosochowski@strath.ac.uk Keywords: Incremental ECAP, ultrafine grained materials, aluminium plates.
Incremental ECAP can be applied also in manufacturing of engineering components because the lower position of shearing punch can be varied, decreasing or increasing work piece height, even locally.
This research was financed by the National Centre for Research and Development within the project “Properties and longterm behaviour of dissimilar joints of advanced materials for lightweight structures in energy saving applications” (Contract no.
Forum. 584-586 (2008) 108–113

New Type of Device for Achievement of Grain Refinement in Metal Strip Stanislav Rusz 1a, Lubomír Čízek1, Vít Michenka2, Jan Dutkiewicz3, Michal Salajka1, Ondřej Hilšer1, Stanislav Tylšar1, Jan Kedroň1, Marcel Klos1 1 VŠB – Technical University of Ostrava, Faculty of Mechanical Engineering, Dept. of Mechanical Technology, 17. listopadu 15, CZ 708 33 Ostrava – Poruba,Czech Republic, stanislav.rusz@vsb.cz 2 Iron and Steel Research Institute CZ 739 51 Dobra, Czech Republic, malanik@vuhz.cz 3c Institute of Metallurgy and Materials Science of the Polish Academy of Sciences 30-059 Kraków ul.
THE MAIN GOAL OF THE PAPER IS A REVIEW OF CURRENT ACHIEVED RESULTS OBTAINED BY PROCESSING OF CUBASED MATERIALS BY DRECE TECHNOLOGY, THE PROTOTYPE EQUIPMENT OF WHICH WAS PUT IN SERVICE TOWARDS THE END OF 2008 AT THE DEPARTMENT OF MECHANICAL TECHNOLOGY, FACULTY OF MECHANICAL ENGINEERING, VSB - TECHNICAL UNIVERSITY OF OSTRAVA.
Pande, Theoretical models of plastic deformation processes in nanocrystalline materials, Reviews on Advanced Materials Science, September 2001, vol. 2, pp. 80 – 102
Valiev, Recent developments of severe plastic deformations techniques for processing bulk nanostructured materials, Materials Science Forum A, 579 (2008) pp. 1–14
Dutkiewicz, Influence of change of direction of deformation at ECAP technology on achieved UFG in AlMn1Cu alloy, Journal of Achievements in Materials and Manufacturing Engineering, Issue 1, vol. 35, 2009, pp. 21 – 28.