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Online since: September 2013
Authors: P.R. Thyla, M. Senthilkumar, Thomas Don Bosco, A. Srikanth, S. Syed Ismail Faiyaz, N. Tiruvenkadam
Reinforced Composite Materials.
Reinforced composite materials are widely used in automobile industry.
Becker, Trends in tribological materials and engine technology.
Metal-matrix composites: Materials aspects.
Journal of Materials Processing Technology. 37 (1993) 521- 541
Reinforced composite materials are widely used in automobile industry.
Becker, Trends in tribological materials and engine technology.
Metal-matrix composites: Materials aspects.
Journal of Materials Processing Technology. 37 (1993) 521- 541
Online since: February 2019
Authors: Nour R. Galyavetdinov, Ruslan R. Safin, P.A. Kainov
However, rubber floor coverings can be made in various ways, as well as from various materials.
Journal of World Applied Sciences.
Journal of Engineering and Applied Sciences.
Journal of Engineering Physics and Thermophysics.
[12] Galyavetdinov, N.R., Improvement of the technology of manufacturing wood-filled composite materials.
Journal of World Applied Sciences.
Journal of Engineering and Applied Sciences.
Journal of Engineering Physics and Thermophysics.
[12] Galyavetdinov, N.R., Improvement of the technology of manufacturing wood-filled composite materials.
Online since: May 2011
Authors: Qin Tang, Xiang Yong Chen, Wei Bing Hu, Gui Yun Zhou
Cai: Journal of materials processing technology Vol. 209(2009), p.1607
[2] B.
Feng, K.Andrew: Materials Science and Engineering A Vol. 445(2007), p.170 [3] C.
Z.Hu, et al.: Journal of functional materials（In chinese）Vol. 37(2006), p. 487 [7] A.I.
Han, L.Cao:Journal of Inorganic Materials（In chinese）Vol. 20(2005) , p.1349 [10] M.
Egon: Journal of colloid and interface science Vol. 218(1999), p.545–553.
Feng, K.Andrew: Materials Science and Engineering A Vol. 445(2007), p.170 [3] C.
Z.Hu, et al.: Journal of functional materials（In chinese）Vol. 37(2006), p. 487 [7] A.I.
Han, L.Cao:Journal of Inorganic Materials（In chinese）Vol. 20(2005) , p.1349 [10] M.
Egon: Journal of colloid and interface science Vol. 218(1999), p.545–553.
Online since: October 2018
Authors: De Hong Huo, Fawad Inam, Islam Shyha, Guo Yu Fu, Bao Le, Mohd Shahneel Saharudin, Jia Cheng Wei
Journal of Manufacturing Science and Engineering, 135 (2013), pp. 041007-041007-7
Journal of Composite Materials, 51 (2017), pp. 1653-1664
International Journal of Thermal Sciences, 94 (2015), pp. 221-227
Journal of Materials Processing Technology, 249 (2017), pp. 96-107
Journal of Materials Science & Technology, 28 (2012), pp. 673-685
Journal of Composite Materials, 51 (2017), pp. 1653-1664
International Journal of Thermal Sciences, 94 (2015), pp. 221-227
Journal of Materials Processing Technology, 249 (2017), pp. 96-107
Journal of Materials Science & Technology, 28 (2012), pp. 673-685
Online since: May 2011
Authors: Ting Xi Li, Su Su Gao, Na Kong, Peng Sui, Shan Ting Li, Shasha Wu
Organic EL devices, or organic light-emitting diodes, are mainly composed of emission materials, hole-transporting materials and electron-transporting materials.
A number of emission materials and hole-transporting materials were reported.
In contrast, materials for electron-transporting materials are only a few [4].
Journal of Functional Materials.
Advanced Materials Research.
A number of emission materials and hole-transporting materials were reported.
In contrast, materials for electron-transporting materials are only a few [4].
Journal of Functional Materials.
Advanced Materials Research.
Online since: April 2014
Authors: Hua Ping Wang, Shi Yan Chen, Lian Tang, Wei Li Zheng, Chuan Lu, Yi Zheng
Experimental
Materials.
[3] Song S., Xu L., He Z., et al, Journal of hazardous materials, 2008, 152(3): 1301-1308
[5] Meng X., Zhang Z., Zhang Y., et al, Materials Science Forum, 2011, 694: 234-238
[6] Song S., Wu S., Peng Y., et al, Journal of Function Materials, 2012, 43(2): 276-280
[10] Qi K., Xin J., ACS Applied Materials & Interfaces, 2010, 2(12): 3479-3485.
[3] Song S., Xu L., He Z., et al, Journal of hazardous materials, 2008, 152(3): 1301-1308
[5] Meng X., Zhang Z., Zhang Y., et al, Materials Science Forum, 2011, 694: 234-238
[6] Song S., Wu S., Peng Y., et al, Journal of Function Materials, 2012, 43(2): 276-280
[10] Qi K., Xin J., ACS Applied Materials & Interfaces, 2010, 2(12): 3479-3485.
Online since: December 2013
Authors: Muhammad Hussain Ismail, Wan Dung Teng, Nor Hafiez Mohamad Nor, Nur Atikah Abu Kasim, M.I.I. Idris
In the modern world with an extensive improvement of science and technologies, alumina (Al2O3) ceramics have been identified as one of the usable materials in production of electronic components.
This process also changes the structure and microstructure of the blend materials [3].
The thermal conductivity of traditional ceramic materials was known to be a function of their porosity or bulk density [8].
Dutta, A numerical model for heat sink with phase change materials and thermal conductivity enhancers, International Journal of Heat and Mass Transfer. 49 (2006) 1833-1844
[7] Koji Atarashiya, Aluminum nitride/metal composites using ultra-fine aluminum particles and their application for joining, Journal of Materials Processing Technology, 54 (1995) 54-59
This process also changes the structure and microstructure of the blend materials [3].
The thermal conductivity of traditional ceramic materials was known to be a function of their porosity or bulk density [8].
Dutta, A numerical model for heat sink with phase change materials and thermal conductivity enhancers, International Journal of Heat and Mass Transfer. 49 (2006) 1833-1844
[7] Koji Atarashiya, Aluminum nitride/metal composites using ultra-fine aluminum particles and their application for joining, Journal of Materials Processing Technology, 54 (1995) 54-59
Online since: September 2013
Authors: Xiang Xin Qiao, Feng Yu, Zhi He Liu
These provide a reference for the project application of piezoelectric materials.
It makes piezoelectric simulation of ceramic materials be convenient and accurate.
Parameters of piezoelectric ceramic materials are needed to input which includes density, dielectric constant matrix ,elastic stiffness constant matrix and piezoelectric constant matrix, when piezoelectric materials are simulated by ANSYS.
The finite element simulation analysis of piezoelectric ceramic materials based on ANSYS[J].
Science & Technology Information，2009,NO.36:39~40
It makes piezoelectric simulation of ceramic materials be convenient and accurate.
Parameters of piezoelectric ceramic materials are needed to input which includes density, dielectric constant matrix ,elastic stiffness constant matrix and piezoelectric constant matrix, when piezoelectric materials are simulated by ANSYS.
The finite element simulation analysis of piezoelectric ceramic materials based on ANSYS[J].
Science & Technology Information，2009,NO.36:39~40
Online since: June 2021
Authors: Eduard Laurentiu Nitu, Daniela Monica Iordache, Mihai Octavian Crăcănel
Weinberger, Process and Tool Development for Friction Stir Welding of Steels, Institute for Materials Science and Welding, Graz, (2010)
Cetkin, Microstructure and Mechanical Properties of AA7075-AA5182 jointed by FSW, Journal of Materials Processing Technology, (2019),vol. 268, 107-116,
Roodgari, Microstructure and mechanical properties of IF/St52 steel composite produced by friction stir lap welding, Materials Science & Engineering , (2020),vol. 772
Series: Materials Science and Engineering, vol. 629, (2019)
Johnson, Microstructure and mechanical properties of friction stir welded AISI321 stainless steel, Journal of Materials Research and Technology, (2020)
Cetkin, Microstructure and Mechanical Properties of AA7075-AA5182 jointed by FSW, Journal of Materials Processing Technology, (2019),vol. 268, 107-116,
Roodgari, Microstructure and mechanical properties of IF/St52 steel composite produced by friction stir lap welding, Materials Science & Engineering , (2020),vol. 772
Series: Materials Science and Engineering, vol. 629, (2019)
Johnson, Microstructure and mechanical properties of friction stir welded AISI321 stainless steel, Journal of Materials Research and Technology, (2020)
Online since: April 2014
Authors: Peng Cheng Zhai, Li Sheng Liu, Ben Huang
Ma, et al: Science, Vol. 320(2008) No.5876, p.634
Liu, et al: Computational Materials Science, Vol. 48(2010) No.2, p.343
Liu, et al: Journal of Electronic Materials, Vol. 39(2010) No.9, p.1730
Plimpton: Journal of Computational Physics, Vol. 117(1995) No.1, p.1
Khosrownejad: Computational Materials Science, Vol. 44(2008) No.2, p.378
Liu, et al: Computational Materials Science, Vol. 48(2010) No.2, p.343
Liu, et al: Journal of Electronic Materials, Vol. 39(2010) No.9, p.1730
Plimpton: Journal of Computational Physics, Vol. 117(1995) No.1, p.1
Khosrownejad: Computational Materials Science, Vol. 44(2008) No.2, p.378