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Nozaki2 1Semiconductor Analysis and Radiation Effects Group, Japan Atomic Energy Agency, 1233 Watanuki, Takasaki, Gunma, 370-1292 Japan 2Department of Electronic Engineering, The University of Electro-Communications, 1-5-1 Chofugaoka, Chofu, Tokyo, 182-8585 Japan 3 National Institute of Advanced Industrial Science and Technology (AIST), 1-1-1 Umezono, Tsukuba, Ibaraki, 305-8568 Japan amakino.takahiro@jaea.go.jp Keywords: heavy ion irradiation, MOS capacitor, single event transient current Abstract.
Forum 645-648 (2010) p.941
Forum 615-617 (2009) p. 861
Forum 615-617 (2009) p.517
Forum 679-680 (2011) p. 362

[7] Dumitru Bălă, Quantitative and qualitative methods in the study of some dynamic systems, Advanced Engineering Forum, Vol 13 (2015) 168-171
[8] Dumitru Bălă, Geometric Dynamics Used in the Study of Mechanical Methods, Advanced Engineering Forum, Vol 27 (2018) 142-146.

The Research of Two Staged Non-isolated Photovoltaic Grid Connected Inverter Control Method Jia Guo*1,2,a, Zhigang Li1,b, Yaping Cheng1,c, Chunyan Cui1,d 1School of Electrical Engineering, Hebei University of Technology, Tianjin 300130, China 2School of Information and Electrical Engineering, Hebei University of Engineering, Handan Hebei 056038, China a guojiazdh@yahoo.cn, bzhigangli@126.com, cyapingcheng@163.com, dchunycui@163.com Keywords: Photovoltaic power, Grid-connected inverter, Topology of inverter, Current control Abstract.
Forum Vol. 41(9):10-16(2009)
Forum Vol. 99:2513-2522(2011)
Forum Vol.59(1): 435-443(2012)
Forum Vol.25(5):1331-1338 (2010)

Anomalous Conduction Between the Band and Nearest­Neighbor Hopping Conduction Regions in Heavily Al­Doped p­Type 4H­SiC Atsuki Hidaka1,a, Akinobu Takeshita1, Kohei Ogawa1, Tatsuya Imamura1, Kota Takano1, Kazuya Okuda1, Hideharu Matsuura1,b, Shiyang Ji2, Kazuma Eto2, Takeshi Mitani2, Kazutoshi Kojima2, Tomohisa Kato2, Sadafumi Yoshida2, and Hajime Okumura2 1Department of Electrical and Electronic Engineering, Osaka Electro­Communication University, Neyagawa, Osaka 572­8530, Japan 2Advanced Power Electronics Research Center, National Institute of Advanced Industrial Science and Technology, Tsukuba, Ibaraki 305­8568, Japan ah­atsuki@osakac.ac.jp, bmatsuura@osakac.ac.jp Keywords: Temperature­dependent resistivity, p­type 4H­SiC, Codoped 4H­SiC, Heavily Al­doped 4H­SiC, Heavily Al­ and N­codoped 4H­SiC, Chemical vapor deposition, Solution growth, Physical vapor transport Abstract.
Forum Vol. 778­780 (2014), p. 135
Forum Vol. 924 (2018), p. 188
Forum Vol. 963 (2019), p. 324
Forum Vol. 821­823 (2015), p. 9

Gömze1,c 1 Department of Ceramic and Silicate Engineering, University of Miskolc, Hungary 2 Kerox Ltd.
Melting points and elastic modulus of advanced technical materials [3] In Fig. 1, it can be seen clearly that the Ts=1600°C sintering temperature is much lower than the melting point of Al2O3, SiO2, MgO, and CaO components.
Gömze, Hetero-modulus alumina matrix nanoceramics and CMCs with extreme dynamic strength, Materials Science and Engineering 18 (2011)
Gömze, Hetero-modulus nanoparticles reinforced corundum matrix CMC with extreme wear and thermal shock resistances,Material Science Forum 659 (2010),165-170 [6] L.
Gömze, Advanced Hetero-Modulus and Hetero-Viscous Complex Materials Material Science Forum 729 (2013) 43-48

Valiev a Institute of Physics of Advanced Materials, Ufa State Aviation Technical University, 12 K.
Special attention is given to topics relating to nanostructuring of metals by SPD processing for advanced properties as well as new trends in developing SPD techniques for practical application.
Another concern of the committee is in introduction and discussion of the terminology applied in this new field of science and engineering.
As a result of the NanoSPD4 conference a decision was taken to publish a collection of papers entitled “Bulk Nanostructured Materials: new ideas for innovation”, which was successfully realized in the special issue of Advanced Engineering Materials in 2010 [17].
Jing Tao Wang was marked with 380 submissions from 29 countries or regions, thus making it clear that NanoSPD is becoming a major development in materials science and engineering.

Preface With the current development of materials science and engineering, many different cost-effective and high-quality materials have come into use in various applications.
Thus, this volume of the journal “Material Science Forum” presents to readers the 1st special issue from the series “Current Advances in Materials Applications”, which contains articles covering different aspects of the research the properties of the materials and methods their applications.

    Preface  During the last decades, the theory of damage mechanics has made significant progress and established itself  capable of solving a wide range of engineering problems. 
The main objective of the conferences series  entitled the nth International Conference on Damage Mechanics (ICDMn) is to bring together leading  educators, researchers, scientists, engineers and other practitioners discussing and exchanging ideas on recent  advances in the field of damage mechanics. 
On the foundation of the International Journal of Damage  Mechanics (IJDM), this conferences series, held every three years, aims to become the premier international  forum on damage mechanics research dissemination. 
It provides a forum for scientists and practicing engineers alike to present  the latest findings in their research endeavour and at the same time to explore future research directions in  the field of damage and failure mechanics. 

High-speed Video of Micro-detonation Arc Machining Process for Engineering Ceramics X.L.
Micro-detonation arc machining (MDAM) is a newly proposed special machining technology for engineering ceramics.
High speed video is an advanced testing method that it can associate spatial information with time information of a high-speed movement or high-speed transient processes.
References [1] Xinli Tian et al., "The new technology of engineering ceramic machining by electrode micro-detonation", Materials Science Forum, vol 626-627, 2009, p. 565-570
[2] Xinli Tian et al., "Research on the removal mechanism of engineering ceramics based on energy density", Key Engineering Materials, vol 443, 2010, p. 439-444

Preface We are delighted to invite you to participate 2011 First International Conference on High Performance Structures and Materials Engineering (ICHPSM 2011) in May 5-6, Beijing, China, 2011.
The objective of (ICHPSM 2011) is to provide a forum for researchers, educators, engineers, and government officials involved in the general areas of Advanced Materials, High Performance Structures and Materials Engineering to disseminate their latest research results and exchange views on the future research directions of these fields. 2011 First International Conference on High Performance Structures and Materials Engineering (ICHPSM 2011) is co-sponsored by International Industrial Electronics Center, Hong Kong, Shenzhen University , China and ACM Hong Kong Chapter.
The mission is to bring together innovative academics and industrial experts in the field of High Performance Structures and Materials Engineering.
The conference will bring together leading researchers, engineers and scientists in the domain of interest.
Mark Zhou, International Industrial Electronics Center, Hong Kong and ACM Hong Kong Chapter Chair   ICHPSM 2011 Organizing Committee Honorary Conference Chairs Wan-Chi Siu, Hong Kong Polytechnic University, Hong Kong David Wang, IEEE Nanotechnology Council Cambodia Chapter, Cambodia Organizing Chairs Mark Zhou, International Industrial Electronics Center, Hong Kong and ACM Hong Kong Chapter Yiyi Zhouzhou,Azerbaijan State Oil Academy,Azerbaijan Program Chairs Dehuai Zeng, Shenzhen University, China Biswanath Vokkarane, Society on Social Implications of Technology and Engineering, Maldives Publication Chair Mark Zhou, International Industrial Electronics Center, Hong Kong and ACM Hong Kong Chapter International Committees Zhu Min , Nanchang University, China Garry Zhu, Thompson Rivers University,Canada Ying Zhang, Wuhan Uniersity, China Dehuai Zeng, Shenzhen University, China Peide Liu, ShangDong