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Online since: May 2012
Authors: M. Katsuno, W. Ohashi, T. Fujimoto, H. Tsuge, Shinya Sato
Sendzik, Materials Science Forum, Vol. 556-557 (2007), p. 21
Ohashi, Materials Science Forum, Vol. 645-648 (2010), p. 9
Camassel1, Materials Scinece Forum, Vol. 645-648 (2010), p. 347
Ohashi, Materials Science Forum, Vol. 645-648 (2010), p. 319
Hoshino, Microelectronic Engineering, Vol. 83 (2006), p. 142
Online since: November 2013
Authors: Sten Johansson, Guo Cai Chai, Mattias Calmunger, Johan Moverare, Ru Lin Peng
Introduction Advanced austenitic materials such as Sanicro 25 are often used as structural materials for applications at elevated temperature.
Fig.1 shows how the engineering stress-strain curve was affected when the temperature increased.
Engineering stress-strain curve at room temperature (RT) and 300°C.
Forum Vol. 519-521 (2006), p. 809 [4] N.
Wang: Materials Science and Engineering A Vol. 491 (2008), p. 425 [5] M.
Online since: August 2009
With the continual development in the modern industry, the coverage of IMCC has expanded from metal cutting to more advanced topics such as manufacturing engineering, modern management as well as information technology.
The 13th International Manufacturing Conference in China (IMCC2009) held in Dalian, China, during 21-23 September 2009 provides another forum to promote the exchange of the development in materials manufacturing science and tyechnology.
It should also be particularly useful for practicing engineers in manufacturing who are responsible for the efficient and effective operations.
Online since: December 2004
Authors: Yang Wang, Li Jun Yang, M. Djendel, L.T. Qi
The process has been seen to demonstrate potential uses in many other engineering applications, some hitherto not possible with other techniques.
There are lots of advantages with laser forming in engineering compared with other forming techniques.
The common engineering stainless steel (1Cr18Ni9Ti) sheet was chosen as the working material for 3D laser forming.
Advances in Materials Manufacturing Science and Technology 570 Fig.4 Typical photos of the experiment Square Sheet.
Advances in Materials Manufacturing Science and Technology 572 References [1] S.P.
Online since: September 2011
Authors: Guo Zhi Li, Wen Feng Li, Yi Ding
The method of system design and advanced tools mean that the use of paper props can be promoted.
Secondary development can build on the generic software such as AutoCAD, Pro/E and OpenGL or direct access to some professional CAD software, such as Box-Vellum, Artios CAD. [2] Design process for paper props Every design of paper pros is the course combing engineering and art.
Thereby under the former support of technical and methodological, the development efficiency of paper props will greatly improved References [1] S.Y.Liu, X.L, Ma, D.L, Ding, Y.P.: Advanced Materials Research, vol.188 (2011),p 336-339 [2] Wang, Song-Hao, Melendez, Steven; Tsai, Chyi-Shyan; Wu, Chi-Wei Source: Materials Science Forum, vol.594 (2008), p 461-468 [3] Yan Huang: Shaped carton innovative design by Box-Vellum, printing technology, 8(2010), p.28 [4] Hao Chen, Mr LAU, Application of CAD technology in the package structure design [J], packaging and food machinery, 2008 (6): 18-20 [5] Chensi Wang, Xinchang Zhang, study on new variable-volume paper folded size of container parameters, package engineering, (2010): 21-23 [6] Jerome Yu, Zimin Xu.
Parameterization of pressing line tray structure and let the tool discussion of, package engineering, 2008 (2)
Online since: June 2014
Authors: Hui Wang, Peter Leisner, Rong Rong Zhang, Sheng Liang Xiao
Analysis of Kinematics and Dynamics of Crank-Rocker Mechanism Hui Wang 1, a,Rongrong Zhang 1,b,Shengliang Xiao 1,c,Peter Leisner2,d 1 Mechanical School, Changzhou University, Changzhou, China 2 Engineering School, Jönköping University, Jönköping, Sweden aemail: wanghui@cczu.edu.cn, bemail:904954331@qq.com, cemail:515721736@qq.com, d email:Peter.Leisner@sp.se Keywords: java; crank-rocker mechanism; kinematics; dynamics Abstract.
In light of the above problems, the dissertation adopts Java advanced programming language and makes programs on the basis of theoretical analysis.
Xi’an: Northwest A&F University, 2006 (In Chinese) [2] Changgao Xia, Lingyun Wang: Tractor & Farm Transporter Forum Vol.5 (2004), p. 29-32.
(In Chinese) [3] Peng Li, Baocheng Zhang, Kaimin Zhao: Mechanical and Electrical Technology, Forum Vol.3 (2011), p.103-105.
(In Chinese) [4] Peng Li, Baocheng Zhang, Kaimin Zhao: Mechanical and Electrical Technology, Forum Vol.3 (2011), p.103-105.
Online since: June 2015
Authors: Tomohisa Kato, Toru Ujihara, Hajime Okumura, Kazuhisa Kurashige, Kuniharu Fujii, Koichi Takei, Nachimuthu Senguttuvan, Masahiko Hiratani, Yuji Matsumoto, Masahiro Aoshima
., 48 Wadai, Tsukuba, Ibaraki 300-4247 Japan 3Department of Materials Science & Engineering, Nagoya University, Furo-cho, Chikusa-ku, Nagoya, Aichi 464-8603 Japan 4Department of Applied Chemistry, Tohoku University, 6-6-07, Aoba, Aramaki, Aoba-ku, Sendai, Miyagi 980-8579 Japan 5National Institute of Advanced Industrial Science and Technology (AIST), 16-1, Onogawa, Tsukuba, Ibaraki 305-8569 Japan akuniharu-fujii@hitachi-chem.co.jp, bk-takei@hitachi-chem.co.jp, cm-aoshima@hitachi-chem.co.jp, dn-senguttu@hitachi-chem.co.jp, em-hiratani@hitachi-chem.co.jp, fujihara@numse.nagoya-u.ac.jp, gmatsumoto@atomol.che.tohoku.ac.jp, ht-kato@aist.go.jp, ih-kurashige@hitachi-chem.co.jp, jh-okumura@aist.go.jp Keywords: SiC, Crystal Growth, Solution Flow, Temperature Distribution, Morphology Abstract The influences of solution flow and lateral temperature distribution on the surface morphology of 4H-SiC single crystal grown from solution was investigated.
Arai, Materials Science Forum, 645 – 648, (2010), p.655 [4] R.
Harada, Materials Science Forum, 717-720, (2012), p.351
Ujihara, Materials Science Forum, 778-780, (2014), p.67
Online since: October 2006
Authors: Michel Pons, Roland Madar, Didier Chaussende
Janzén: Materials Science Forum Vols. 338-342, (2000), p. 237
Muller: Materials Science & Engineering, B: Solid-State Materials for Advanced Technology Vols.
Duffar: Materials Science Forum Vols. 338342, (2000), p. 119
Winnacker: Materials Science Forum Vols. 338-342, (2000), p. 107
Online since: May 2014
ICDMM2014 provided an excellent international academic forum for sharing knowledge and results in theory, methodology and applications of Design, Manufacturing and Mechatronics and Material Science.
The ICDMM2014 conference covers the recent research and application in the area of Advanced Design and Manufacturing Technologies, Technology and Method for Measurement, Test, Detection and Monitoring, Applied Materials and Materials Processing Technology, Control System and Automation, Sensor Technology, Computer Science and Applications and Applied Mechatronics.
We hope this volume will not only provide the readers a broad overview of the latest research results on material science and engineering, but also provide the readers a valuable summary and reference in these fields.
China Dr.Xiangjiang He, Yanshan University, China Dr.Jun Gao, Hebei University, China Dr.Yuanzhen Liu, South China University of Technology, China Dr.Degui Min, Guangdong University of Technology, China Dr.Jing Lin, Yanshan University, China Dr.Yanbo Wu, Jinan University, China Dr.Leili Du, Shandong University, China Dr.Bingjie Zhang, Beijing Technology and Business University, China Dr.Weizun Zeng, Guangdong University of Technology, China Dr.Jie Dai, Guangdong University of Technology, China Dr.Xinshu Feng, Chengdu University, China Dr.Weiyue Zhen, Jinan University, China Dr.Ningli Kong, Hebei University, China Dr.Jianwei Zhou, Shandong Polytechnic University, China Dr.Xinyi Yu, Chengdu University, China Dr.Junfeng Guo, Harbin Institute of Technology, China Dr.Hui Liu, Hebei University, China Dr.Qianqian Ye, Southwest University, China Dr.Wufu Sheng, Hebei University, China Organizer Advanced
Online since: August 2014
Edited by: S. Rama Reddy, Venkatesan Jamuna, Nagarajan Booma, Natesan Saritha
This journal consists of collection of selected, peer reviewed papers from the International Conference on Emerging Trends in Science, Engineering and Technology (ICETSET-2014) held during 18th and 19th April 2014 at Jerusalem College of Engineering, Chennai.
Develop a forum towards smart, sustainable and secured technology.
Provide a supportive setting for feedback on current research and guidance on future research directions.To strengthen Industry-Institute interaction ties and lay foundation for engineering a better world.
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