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Online since: June 2018
Authors: Hajime Okumura, Kazutoshi Kojima, Tomohisa Kato, Sadafumi Yoshida, Hideharu Matsuura, Kazuma Eto, Shi Yang Ji, Akinobu Takeshita, Kota Takano, Tatsuya Imamura, Kazuya Okuda, Atsuki Hidaka
Comparison of Conduction Mechanisms in Heavily Al-Doped 4H-SiC and Heavily Al- and N-Codoped 4H-SiC
Hideharu Matsuura1,a *, Akinobu Takeshita1, Tatsuya Imamura1, Kota Takano1, Kazuya Okuda1, Atsuki Hidaka1, Shiyang Ji2, Kazuma Eto2, Kazutoshi Kojima2, Tomohisa Kato2, Sadafumi Yoshida2 and Hajime Okumura2
1Department of Electrical and Electronic Engineering, Osaka Electro-Communication University, Neyagawa, Osaka 572-8530, Japan
2Advanced Power Electronics Research Center, National Institute of Advanced Industrial Science and Technology, Tsukuba, Ibaraki 305-8568, Japan
amatsuura@osakac.ac.jp
Keywords: Temperature-dependent resistivity, p-type 4H-SiC, Codoped 4H-SiC, Heavily doped 4H-SiC, Al-doped 4H-SiC, Al- and N-codoped 4H-SiC
Abstract: The conduction mechanisms in heavily Al-doped and heavily Al- and N-codoped p-type 4H-SiC epilayers were investigated.
Forum 778-780 (2014) 135-138
Forum 740-742 (2013) 181-184
Forum 457-460 (2004) 685-688
Forum 556-557 (2007) 367-370
Forum 778-780 (2014) 135-138
Forum 740-742 (2013) 181-184
Forum 457-460 (2004) 685-688
Forum 556-557 (2007) 367-370
Online since: October 2006
Authors: Nicolas G. Wright, Irina P. Nikitina, Praneet Bhatnagar, Alton B. Horsfall, Konstantin Vassilevski, Peter Tappin, C.H.A. Prentice
Nikitina
1
1
School of Electrical, Electronic and Computer Engineering, Merz Court, University of Newcastle,
Newcastle, NE1 7RU, U.K.
Despite the recent advances in the quality of oxide layers on SiC, the mobility of inversion layers is still low and this will affect the maximum frequency of the operation for these devices.
Despite recent advances in the fabrication of the silicon carbide / silicon dioxide interface [1] and the introduction of high κ dielectric structures [2], the mobility under the gate dielectric is always low and this is mainly due to the influence of interface states [3] at the SiC/SiO2 interface.
Perez-Tomas, et al.: Materials Science Forum, Vols. 483 - 485, (2005), p. 713 [3] E.
Takahashi, et al.: Materials Science Forum, Vols. 457 - 460, (2004), p. 743 [6] A.
Despite the recent advances in the quality of oxide layers on SiC, the mobility of inversion layers is still low and this will affect the maximum frequency of the operation for these devices.
Despite recent advances in the fabrication of the silicon carbide / silicon dioxide interface [1] and the introduction of high κ dielectric structures [2], the mobility under the gate dielectric is always low and this is mainly due to the influence of interface states [3] at the SiC/SiO2 interface.
Perez-Tomas, et al.: Materials Science Forum, Vols. 483 - 485, (2005), p. 713 [3] E.
Takahashi, et al.: Materials Science Forum, Vols. 457 - 460, (2004), p. 743 [6] A.
Online since: June 2008
Roberto Frias, s/n
4200-465 Porto
Portugal
Tel: +351 225081716
Fax: +351 225081584
E-mail: ffonseca@fe.up.pt
Webpage: www.fe.up.pt/materiais2007
MATERIAIS 2007 sponsors:MATERIALS and THE CITY exhibition supporters:
MATERIAIS 2007 supporters:
Júlio L. de
FigueiredoForeword
This special issue of Materials Science Forum is dedicated to a selection of papers
presented at MATERIAIS 2007 - 13th Conference of Sociedade Portuguesa de Materiais,
IV International Materials Conference Symposium - A Materials Science Forum: "Global
Materials for the XXI Century: Challenges to Academia and Industry".
From the 600 papers presented at the Conference, 450 remained for the review procedure according to Materials Science Forum rules and 200 were finally selected for publication.
The number of papers per chapter is as follows: Chapter 1 - Biomaterials (19 papers) Chapter 2 - Ceramics (16 papers) Chapter 3 - Composite Materials (15 papers) Chapter 4 - Electronic, Magnetic and Photonic Materials (20 papers) Chapter 5 - Metals and Alloys (17 papers) Chapter 6 - Nano and Microstructural Materials (12 papers) Chapter 7 - Polymers (17 papers) Chapter 8 - Paper, Textiles, Wood and Cork (7 papers) Chapter 9 - Smart Materials (6 papers) Chapter 10 - Advances in Materials Characterization (7 papers) Chapter 11 - Materials and Processing Modelling (9 papers) Chapter 12 - Recycling (10 papers) Chapter 13 - Surfaces, Interfaces and Membranes (12 papers) Chapter 14 - Materials for Civil Engineering Applications (12 papers) Chapter 15 - Materials for Energy Production, Transport, Storage and Mechanical Engineering Applications (14 papers) Chapter 16 - Foresight, Materials and Art, Generic (7 papers)This Special Issue
From the 600 papers presented at the Conference, 450 remained for the review procedure according to Materials Science Forum rules and 200 were finally selected for publication.
The number of papers per chapter is as follows: Chapter 1 - Biomaterials (19 papers) Chapter 2 - Ceramics (16 papers) Chapter 3 - Composite Materials (15 papers) Chapter 4 - Electronic, Magnetic and Photonic Materials (20 papers) Chapter 5 - Metals and Alloys (17 papers) Chapter 6 - Nano and Microstructural Materials (12 papers) Chapter 7 - Polymers (17 papers) Chapter 8 - Paper, Textiles, Wood and Cork (7 papers) Chapter 9 - Smart Materials (6 papers) Chapter 10 - Advances in Materials Characterization (7 papers) Chapter 11 - Materials and Processing Modelling (9 papers) Chapter 12 - Recycling (10 papers) Chapter 13 - Surfaces, Interfaces and Membranes (12 papers) Chapter 14 - Materials for Civil Engineering Applications (12 papers) Chapter 15 - Materials for Energy Production, Transport, Storage and Mechanical Engineering Applications (14 papers) Chapter 16 - Foresight, Materials and Art, Generic (7 papers)This Special Issue
Online since: May 2017
Authors: Tomohisa Kato, Toru Ujihara, M. Tagawa, Kenta Murayama, Shunta Harada, Goki Hatasa
Solvent Design for High-Purity SiC Solution Growth
Shunta Harada1,2, a*, Goki Hatasa2, b, Kenta Murayama1, c, Tomohisa Kato3, d, Miho Tagawa1,2, e, Toru Ujihara1,2, f
1Center for Integrated Research of Future Electronics (CIRFE), Institute of Materials and Systems for Sustainability (IMaSS), Nagoya University, Furo-cho, Chikusa-ku, Nagoya, 464-8603, Japan
2Department of Materials Science and Engineering, Nagoya University,
Furo-cho, Chikusa-ku, Nagoya, 464-8603, Japan
3Advanced Power Electronics Research Center (APERC), National Institute of Advanced Industrial Science and Technology (AIST), 16-1 Onogawa, Tsukuba, Ibaraki, 305-8569, Japan
aharada@numse.nagoya-u.ac.jp, bhatasa.gouki@f.mbox.nagoya-u.ac.jp, cmura_mura@sic.numse.nagoya-u.ac.jp, dt-kato@aist.go.jp, emtagawa@numse.nagoya-u.ac.jp, fujihara@nagoya-u.jp,
Keywords: SiC, top-seeded solution growth, impurity, CALPHAD, yttrium
Abstract.
Forum, 740-742 (2013) 189
Forum, 457-460 (2004) 123
Forum, 645-648 (2010) 13
Forum 740-742 (2013) 73.
Forum, 740-742 (2013) 189
Forum, 457-460 (2004) 123
Forum, 645-648 (2010) 13
Forum 740-742 (2013) 73.
Heat and Mass Transfer during Drying of Clay Ceramic Materials: A Three-Dimensional Analytical Study
Online since: June 2017
Authors: M.K. Teixeira de Brito, D.B. Teixeira de Almeida, L. Almeida Rocha, E. Santana de Lima, V.A. Barbosa de Oliveira, A.G. Barbosa de Lima
Callister, Jr., Materials science and engineering: An introduction, 7th ed., John Wiley & Sons, Inc., New York, 2007
Kaasschieter, On the risk of cracking in clay drying, Chemical Engineering Journal. 86 (2002) 133-138
Forum. 312-315 (2011) 971-976
Forum. 353 (2014) 116-120
Drying and Energy Technologies, Series: Advanced Structured Materials. 63ed, Springer-Verlag, Heidelberg (Germany), 2015, v. 63, pp. 43-70.
Kaasschieter, On the risk of cracking in clay drying, Chemical Engineering Journal. 86 (2002) 133-138
Forum. 312-315 (2011) 971-976
Forum. 353 (2014) 116-120
Drying and Energy Technologies, Series: Advanced Structured Materials. 63ed, Springer-Verlag, Heidelberg (Germany), 2015, v. 63, pp. 43-70.
Online since: December 2004
Authors: Zhe Qin, Cheng Yong Wang, J.L. Wang, Ying Ning Hu
Materials Science Forum Vols. *** (2004) pp.374-379
online at http://scientific.net
2004 Trans Tech Publications, Switzerland
Surface Quality Analysis of Milling Hardened Die Steel with Micro-end
Mill
Y.N.
Qin 1,d 1Institute of Manufacturing Technology, Guangdong University of Technology, 510090 Guangzhou, PR China 2 College of Mechanical Engineering, Guangxi University, 530004 Nanning, PR China a hyn@gxu.edu.cn, bcywang@gdut.edu.cn , cgoldlong79@163.com, dqinzhe@163.net Keywords: Micro-end mill, Hardened steel, Surface quality Abstract.
When fz Advances in Materials Manufacturing Science and Technology 376 ≥0.016mm/tooth, Ra values increase with feed per tooth.
The machining system being in stable state in this experiment Advances in Materials Manufacturing Science and Technology 378 indicates that it is feasible to increase cutting speed in mid-high speed milling, but the sympathetic vibration will occur under a certain critical speed.
Ad = 0.10mm Ad = 0.30mm (a) Vibration power spectrum Ad = 0.10mm Ad = 0.20mm Ad = 0.30mm (b) SEM micrographs of chip top Materials Science Forum Vols. *** 379 3.
Qin 1,d 1Institute of Manufacturing Technology, Guangdong University of Technology, 510090 Guangzhou, PR China 2 College of Mechanical Engineering, Guangxi University, 530004 Nanning, PR China a hyn@gxu.edu.cn, bcywang@gdut.edu.cn , cgoldlong79@163.com, dqinzhe@163.net Keywords: Micro-end mill, Hardened steel, Surface quality Abstract.
When fz Advances in Materials Manufacturing Science and Technology 376 ≥0.016mm/tooth, Ra values increase with feed per tooth.
The machining system being in stable state in this experiment Advances in Materials Manufacturing Science and Technology 378 indicates that it is feasible to increase cutting speed in mid-high speed milling, but the sympathetic vibration will occur under a certain critical speed.
Ad = 0.10mm Ad = 0.30mm (a) Vibration power spectrum Ad = 0.10mm Ad = 0.20mm Ad = 0.30mm (b) SEM micrographs of chip top Materials Science Forum Vols. *** 379 3.
Online since: June 2014
Authors: Hui Wang, Peter Leisner, Rong Rong Zhang, Sheng Liang Xiao
Analysis of Kinematics and Dynamics of Crank-Rocker Mechanism
Hui Wang 1, a,Rongrong Zhang 1,b,Shengliang Xiao 1,c,Peter Leisner2,d
1 Mechanical School, Changzhou University, Changzhou, China
2 Engineering School, Jönköping University, Jönköping, Sweden
aemail: wanghui@cczu.edu.cn, bemail:904954331@qq.com,
cemail:515721736@qq.com, d email:Peter.Leisner@sp.se
Keywords: java; crank-rocker mechanism; kinematics; dynamics
Abstract.
In light of the above problems, the dissertation adopts Java advanced programming language and makes programs on the basis of theoretical analysis.
Xi’an: Northwest A&F University, 2006 (In Chinese) [2] Changgao Xia, Lingyun Wang: Tractor & Farm Transporter Forum Vol.5 (2004), p. 29-32.
(In Chinese) [3] Peng Li, Baocheng Zhang, Kaimin Zhao: Mechanical and Electrical Technology, Forum Vol.3 (2011), p.103-105.
(In Chinese) [4] Peng Li, Baocheng Zhang, Kaimin Zhao: Mechanical and Electrical Technology, Forum Vol.3 (2011), p.103-105.
In light of the above problems, the dissertation adopts Java advanced programming language and makes programs on the basis of theoretical analysis.
Xi’an: Northwest A&F University, 2006 (In Chinese) [2] Changgao Xia, Lingyun Wang: Tractor & Farm Transporter Forum Vol.5 (2004), p. 29-32.
(In Chinese) [3] Peng Li, Baocheng Zhang, Kaimin Zhao: Mechanical and Electrical Technology, Forum Vol.3 (2011), p.103-105.
(In Chinese) [4] Peng Li, Baocheng Zhang, Kaimin Zhao: Mechanical and Electrical Technology, Forum Vol.3 (2011), p.103-105.
Online since: October 2006
Authors: Roland Madar, Michel Pons, Didier Chaussende
Janzén:
Materials Science Forum Vols. 338-342, (2000), p. 237
Muller: Materials Science & Engineering, B: Solid-State Materials for Advanced Technology Vols.
Duffar: Materials Science Forum Vols. 338342, (2000), p. 119
Winnacker: Materials Science Forum Vols. 338-342, (2000), p. 107
Muller: Materials Science & Engineering, B: Solid-State Materials for Advanced Technology Vols.
Duffar: Materials Science Forum Vols. 338342, (2000), p. 119
Winnacker: Materials Science Forum Vols. 338-342, (2000), p. 107
Online since: June 2015
Authors: Tomohisa Kato, Hajime Okumura, Toru Ujihara, Kazuhisa Kurashige, Kuniharu Fujii, Koichi Takei, Masahiko Hiratani, Nachimuthu Senguttuvan, Masahiro Aoshima, Yuji Matsumoto
., 48 Wadai, Tsukuba, Ibaraki 300-4247 Japan
3Department of Materials Science & Engineering, Nagoya University, Furo-cho, Chikusa-ku, Nagoya, Aichi 464-8603 Japan
4Department of Applied Chemistry, Tohoku University, 6-6-07, Aoba, Aramaki, Aoba-ku, Sendai, Miyagi 980-8579 Japan
5National Institute of Advanced Industrial Science and Technology (AIST), 16-1, Onogawa, Tsukuba, Ibaraki 305-8569 Japan
akuniharu-fujii@hitachi-chem.co.jp, bk-takei@hitachi-chem.co.jp, cm-aoshima@hitachi-chem.co.jp, dn-senguttu@hitachi-chem.co.jp, em-hiratani@hitachi-chem.co.jp, fujihara@numse.nagoya-u.ac.jp, gmatsumoto@atomol.che.tohoku.ac.jp, ht-kato@aist.go.jp, ih-kurashige@hitachi-chem.co.jp, jh-okumura@aist.go.jp
Keywords: SiC, Crystal Growth, Solution Flow, Temperature Distribution, Morphology
Abstract The influences of solution flow and lateral temperature distribution on the surface morphology of 4H-SiC single crystal grown from solution was investigated.
Arai, Materials Science Forum, 645 – 648, (2010), p.655 [4] R.
Harada, Materials Science Forum, 717-720, (2012), p.351
Ujihara, Materials Science Forum, 778-780, (2014), p.67
Arai, Materials Science Forum, 645 – 648, (2010), p.655 [4] R.
Harada, Materials Science Forum, 717-720, (2012), p.351
Ujihara, Materials Science Forum, 778-780, (2014), p.67