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Online since: August 2011
Authors: Jing Hua Yu, Wei Qiang Gao, Shen Guang Ge, Jia Dong Huang, Mei Yan
Ltd, and Tian Jin Da Mao Chemical Reagent Factory (Tian Jin, China), and used as received.
Yang, A.
Yang, Q.
Yang, A.
Yang, Q.
Online since: July 2011
Authors: Hai Bin Li, Qing Xin Zhang, Jin Li, Chong Liu
[5] Tian Muling, Wang Xiaoling.
[D] Shen Yang: Northeast University, 2005
[10] Han Tian, Yin Zhongjun, Yang Shaowei.
[D] Shen Yang: Northeast University, 2005
[10] Han Tian, Yin Zhongjun, Yang Shaowei.
Online since: September 2013
Authors: Yin Sheng Yang, Yun Cheng, Chang Qing Guo
Vol. 7 (2008), p. 100
[2] Jy.Tian, Jh.
Yang, B.J.Ma, K.Masayuki:Jour.
Yang: Ann.
Yang, B.J.Ma, K.Masayuki:Jour.
Yang: Ann.
Online since: November 2011
Authors: Shen Jenn Hwang, Chi Tsung Tsai, Wei Long Liu
Al2O3 nanowire was also synthesized at elevated temperature from Al and Al2O3 powders by Zhao et.al.[10] Tian et.al.[11] prepared alumina nanowire on Al foil in phosphoric acid by anodizing and etching treatment.
[7] Yang, Rui; Sui, Chunhong; Gong, Mater.
[11] Tian, Y.
[7] Yang, Rui; Sui, Chunhong; Gong, Mater.
[11] Tian, Y.
Online since: January 2012
Authors: Hui Jun Deng, Yi Xu, Lei Cao
[2] GENG Jun-hao, ZHANG Zhen-ming, TIAN Xi-tian, ZHANG Ding-hua.
[4] ZHAN Hong-fei, YANG Jian-jun, YU Fang-he.
[4] ZHAN Hong-fei, YANG Jian-jun, YU Fang-he.
Online since: November 2011
Authors: Hui Li, Hong Liang Liu, Shi Qiang Cui, Shou Zhi Pu
Yang, S.Z.
Tian, B.Z.
Tian: Chem.
Tian, B.Z.
Tian: Chem.
Online since: May 2014
Authors: Zhi Gang Chen, Ju Shu, Qian Wu
Introduction
In recent years, the study of unknown objects became a hot spot, F.Y.Tian and the others [1] studied two conditions of capturing unknown objects by single arm and two arms, and do inertia parameter identification based on the conservation of momentum.
References [1] F.Y.Tian,H.T.Wu,D.X.Zhao, et al.
[8] Guo A, Hong J, Yang H.
References [1] F.Y.Tian,H.T.Wu,D.X.Zhao, et al.
[8] Guo A, Hong J, Yang H.
Online since: November 2014
Authors: E.P. Ooi, R. Daud, N.A.M. Amin, T.W. Hong
The size effect on the shear strength of as-reflowed and aged Sn3.0Ag0.5Cu/Cu solder joints was significant revealed by YanHong Tian [2].
YanHong Tian [2] reported that the shear strength of the solder joints were dramatically decreased within 4 days thermal aging but then kept constant with longer aging time.
Table 1: Deviations of predicted solder joint fatigue life from measured/experimental values.[3] Author Package Solder Model Experimental (Cycle) Predicted (Cycle) Deviation from experimental(%) Lee and Lau (2004) PBGA SnAgCu Coffin-Manson 4772 3310 -31 Zhang et al. (2003) CSP SnPb Modified Darveaux 856 745 12.9 Rodgers et al. (2004) Micro BGA SnAgCu Schubert et al. 4123 2417 -41.4 Lau and Lee (2004) PBGA SnPb Modified Coffin-Manson 2826 2840 0.5 Yang and Ume (2008) FC SnPb Anand/Zahn 54 60 11.1 The variations across the columns in the values of experimental and predicted solder joint fatigue life in Table 1 are expected because the values depend on many factors which vary among the investigations.
[2] Yanhong Tian, Chunjin Hang, Chunqing Wang, Shihua Yang, Pengrong Lin, “Effects of bump size on deformation and fracture behavior of Sn3.0Ag0.5Cu/Cu solder joints during shear testing”, Materials Science and Engineering A 529 (2011) 468– 478
YanHong Tian [2] reported that the shear strength of the solder joints were dramatically decreased within 4 days thermal aging but then kept constant with longer aging time.
Table 1: Deviations of predicted solder joint fatigue life from measured/experimental values.[3] Author Package Solder Model Experimental (Cycle) Predicted (Cycle) Deviation from experimental(%) Lee and Lau (2004) PBGA SnAgCu Coffin-Manson 4772 3310 -31 Zhang et al. (2003) CSP SnPb Modified Darveaux 856 745 12.9 Rodgers et al. (2004) Micro BGA SnAgCu Schubert et al. 4123 2417 -41.4 Lau and Lee (2004) PBGA SnPb Modified Coffin-Manson 2826 2840 0.5 Yang and Ume (2008) FC SnPb Anand/Zahn 54 60 11.1 The variations across the columns in the values of experimental and predicted solder joint fatigue life in Table 1 are expected because the values depend on many factors which vary among the investigations.
[2] Yanhong Tian, Chunjin Hang, Chunqing Wang, Shihua Yang, Pengrong Lin, “Effects of bump size on deformation and fracture behavior of Sn3.0Ag0.5Cu/Cu solder joints during shear testing”, Materials Science and Engineering A 529 (2011) 468– 478