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Design of Wireless Intelligent Electronics Card Four-element Rectangular Micro-strip Antenna Array Zhou Yue Department of Communication and Control Engineering, Hunan University of Humanities and Science and Technology, Loudi, Hunan, 417001, China yuezhou2000@163.com Keywords: wireless intelligent electronic card, four-element rectangular micro-strip antenna array, radio frequency identification technology Abstract.
With the basic necessities of daily life are closely related to the wireless smart card already substantial popularity of electronics and applications, scientific research institutes at home and abroad, and smart card companies in the development and application of inputs are many human and material resources, has also been made with a bright future results.
Abroad in order to prevent the parking lane between the wireless wake-up signals interfere with each other, be able to use the microwave absorption characteristics of the material into the isolation plate, then the use of these isolation plate separation between the lanes, but the wake-up signal when the leak situation has happened, but the cost of this design is more expensive, but also near the lane leading to the wireless smart card being erroneous wake-up [1].
Journal of System Simulation. 2007,6(11)：2603～2605

Swain National Research Laboratory of Charged Nanoparticle School of Materials Science and Engineering Seoul National University, Seoul, South Korea Phone- 8228809152, Fax- 8228809152 Keywords:- HWCVD, Residual stress, nc-Si, Raman spectra Abstract p doped nano-crystalline silicon (nc-Si) were deposited by hot wire chemical vapour deposition (HWCVD) using SiH4, H2 and B2H6 precursors. nc-Si was characterized by XRD, Raman and residual stress.
[2] Hyung Kew Lee, Seung Yeop Myong, Koeng Su Lim and Euisik Yoon, Journal of Non-Crystalline Solids, Vol. 316 (2003), p. 297-301

References [1] Nam Pyo Suh: Axiomatic design-advanced and application (Oxford University Press, London 2001) [2] Longying Zhu, Rupeng Zhu, Zhengxun Liu: Machine Design and Research Vol. 8 (2004), p.43 (in Chinese) [3] Zhengbi Luo, Xuejun Yu: Machine and Metal Vol. 4 (2006), p.87 (in Chinese) [4] Ping Wang, Deping Gao: Mechanical Science and Technology for Aerospace Engineering Vol. 7 (2004), p.873 (in Chinese) [5] Kai Zhou: Aerospace Manufacturing Technology Vol. 4 (2004), p.23 (in Chinese) [6] Xianfu Cheng, Renbin Xiao: Transactions of the Chinese Society for Agricultural Machinery Vol. 3(2007), p.117 (in Chinese) [7] Gang Liu, Yaozu Lu, Jinyue Tian, Qing Zhang: Journal of Machine Design Vol. 7(2007), p.3 (in Chinese) [8] Kunli Mao: Advanced Materials Research Vols.834-836 (2014), p1476

Acknowledgement Jiangxi Science and Technology Program (20111BBE50029), Jiangxi Provincial Department of Education Project (DB201103093) References [1] M.
Spong, Reduction-based control of three dimensional bipedal walking robots, International Journal of Robotics Research 29 (6) (2010) 680–702
Advanced Materials Research Vols. 503-504 (2012) 82-85

Determination of the Geographic Origin of Rice by Chemometrics with the Ethyl Acetate Extracts from Rice Shigang Shen* a, Liya Xiab and Dongjun Gongc College of Chemistry & Environmental Science, Hebei University, Baoding, China Key Laboratory of Medical Chemistry and Molecular Diagnosis, Ministry of Education, Baoding, China College of Quality & Technical Supervision, Hebei University, Baoding, China ashensg@hbu.cn, bxialiya@126.com, cGongdongjun@sina.com Keywords: Rice, geographic origin, high performance liquid chromatography, principal component analysis, linear discriminant analysis, ethyl acetate extracts Abstract.
Materials.
Journal of Liquid Chromatography & Related Technologies, Vol. 34(2011), p.1952–1964

Introduction In recent years Pyrex glass is an important mainstream material which can be commonly used in micro-inertial(such as MEMS gyro and accelerator) devices, microliquid chips, micro photoelectron devices, pressure sensors and so on[3,4].
Table.1 the contrast of the proportion and effects of glass etching solutions Mask material proportion of corrosion solution Temp （℃） velocity （nm/min） the ratio of etching depth to the lateral undercutting State of the Etched surface Al ①HNO3:H2O: NH4F ( 126:60: 5)[7] 20-25 ～2200 1.35 rough Photo resist or Cr/ Au ②40%NH4F:49%HF (5:1) 40 102 1.13 smooth Photo resist + Cr/Au ③ HF:HCL:H2O (3:6:10) 20-25 650 0.96 smooth relatively Photo resist or Al ④ STS 320 RIE CF4+O2[7] 31 1.15 smooth relatively Solution① has very smart reactions in the process, the depth was etched too fast to control accurately and the fringe effects are easily produced because the etching velocity of the edge is faster than the center region.
GSG(glass-silicon-glass) micro-fluidic devices with the glass via-hole etching technology References [1] M.Bu, T.Melvin,G.Ensell,J.S.Wilkinson and A.G.R.Evans: New deep glass etching technology, http:www.micro.ecs.ac.uk/mems/index.html [2] Method of forming a via hole through a glass wafer: http:www.patentstrom.us/patents /7084073/ fulltext.htm [3] A.Q.Liu,A.B.Yu,M.F.Karim,M.Tang: RF MEMS switches and integrated switching circuits, Journal of semiconductor technology and science,Vol.7,No.3,2007 [4] Chiung-Wen Lin,Hsueh-an Yang, Leonardo Wang,Weileun Fang: Applied through-wafer interconnections and anodic bonding in SOI-MEMS wafer level packaging

[3] Shen.Design and implementation of Intelligent building energy monitoring system[D], University of Electronic Science and Technology master's degree thesis, 2010.In Chinese
Clem: submitted to Journal of Materials Research (2003)

Such sealing way most likely to cursh materials of the mouth of the bottles and make them fall into the bottles so that pollute the liquid.
China Safety Science Journal.

Recent Activities on Sensing and Adaptive Control of Arc Welding[C]，Proceedings of the 3rd International Trends in Welding Science and Technology Gatlinburg,USA, S.
Vitek, ASM International Materials Park, Ohio, 1992, p.833~842
Welding Journal 2005, Vol.26 (12), p.32 ~ 34

The paper’s(3)(4) results indicated that the main factors which influence the subgrade strength are the kinds and gradations of filling materials, moisture, compactness, examination method and so on. we can ensure the subgrade strength through controlling the above factors.
References [1] Tongzhiya Yuyingtao Application of Impact Compaction Technique in High Earth Fill Subgrade, North Communication No.1, 2007 [2] Likan, the relation between subgrade compaction and subgrade bearing ability, Science and Technology Consulting Herald 2007.11 [3] Zhao siyuan, lu dingfang, wangjinrui, analysis of the influence factors about subgrade compacting degree, oil field engineering on earth, 2007.2 [4] HUANG Chang-wei,HUANG Xiao-jian,Control Measures of the Degree of Compaction of Grade Classified Highways, journal of guang dong communication polytechnic March.2004 [5] Deng xuejun, Road Subgrade And Pavement Engineering, china communications press, 2005.8