Fabrication of Micro Via-Hole by Wet Etching of Pyrex Glass

Shi Xing Jia; Long Zhang; Jian Zhu

doi:10.4028/www.scientific.net/AMR.60-61.303

Paper Titles

Preparation and Optical Absorption Properties of CuO/SiO₂ Nanocomposite Films Fabricated by Sol-Gel Technique
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Investigation of Thermal Bonding on PMMA Capillary Electrophoresis Chip
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Deep Hole Fabrication Based on ICP Process
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Design and Simulation of a Z-Axis Dual Proof Mass Micromachined Gyroscope with Decoupled Oscillation Modes
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Fabrication of Micro Via-Hole by Wet Etching of Pyrex Glass
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Study of Compensatation of the Nonlinear Errors for Thick Film Capacitor Micro-Displacement Sensor
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Highly Sensitive Determination of Dopamine Using Osmium/Nafion Modified Disposable Integrated Biosensor
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Size-Dependent Elasticity of Silicon Nanowires
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A New Method Based on Electropolymerizing Staphylococcal Protein A to Immobilize Antibody in Micro Amperometric Immunosensor
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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 60-61Fabrication of Micro Via-Hole by Wet Etching of...

Fabrication of Micro Via-Hole by Wet Etching of Pyrex Glass

Abstract:

A method of fabrication of micro via-hole by wet-etching of Pyrex glass is presented in the paper. The through holes with double funnel-shape have been fabricated attribute to isotropic etching. Furthermore, the funnel-shape holes are advantageous to the joint sealing and have been applied to fabricate microfluid chips. The results show that the proportioning of corrosion solution is HF:HCl:H2O=3:6:10, and the corrosion rate is about 0.67um/min, the diameter of the holes on the both-side of the wafer is only 750 um, the middle ones are 300um