Investigation of Thermal Bonding on PMMA Capillary Electrophoresis Chip

Hai Feng Zhang; Xiao Wei Liu; Zhi Cheng Peng; Wei Wang; Yu Feng Chen

doi:10.4028/www.scientific.net/AMR.60-61.288

Paper Titles

Effect of the Prepared Proceeding on Mechanical and Tribological Properties of DLC Films
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Error Autocompensation of Micromachined Gyroscopes
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Substrate Dependent Morphologies and Luminescence Properties of ZnO Nanostructures Prepared by Thermal Evaporation
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Preparation and Optical Absorption Properties of CuO/SiO₂ Nanocomposite Films Fabricated by Sol-Gel Technique
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Investigation of Thermal Bonding on PMMA Capillary Electrophoresis Chip
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Deep Hole Fabrication Based on ICP Process
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Design and Simulation of a Z-Axis Dual Proof Mass Micromachined Gyroscope with Decoupled Oscillation Modes
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Fabrication of Micro Via-Hole by Wet Etching of Pyrex Glass
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Study of Compensatation of the Nonlinear Errors for Thick Film Capacitor Micro-Displacement Sensor
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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 60-61Investigation of Thermal Bonding on PMMA Capillary...

Investigation of Thermal Bonding on PMMA Capillary Electrophoresis Chip

Abstract:

PMMA, Capillary Electrophoresis, Thermal bonding, Factor, Deformation. Abstract. In this paper, using the powder hot embossing machine, the effects of the bonding temperature, pressure and time on the deformation of microchannel dimensions is studied systematically. The bonding temperature is mainly influence factor on the deformation of microchannel determined by the method of orthogonal experiment. Some mathematical models are described to optimize the thermal bonding process parameters. According theory and experimental curve, the optimal experimental model (83°C, 0.4Mpa and 7 min) is suggested. Under the process parameters the deformation of crossing section dimension before and after thermal bonding is 37.8%. The channel is successfully sealed underneath with a thin foil 30μm thickness PMMA for contactless conductivity detection. The entire fabrication methodology may also be useful for preparation of other polymer microfluidic systems. Finally, the performance of the PMMA chip is demonstrated to separate continuously K+ ions using the contactless conductivity detection.