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Recently, progress of the intelligent materials plays a big role in development of science and technology.
Kanada: A new drive system using a shape memory alloy(SMA) heat engine and its applications, Journal of Journal of Optoelectronics and Advanced Materials, vol.10, No.5, 2008 [2] T.
Enokizono: Magnetic properties and shape memory effect of Fe-Mn-Cr-Si-R-B ferromagnetic shape memory alloy, Journal of Optoelectronics and Advanced Materials, vol.10, No.5, 2008 [4] T.
Meng Zhang: Local Graded Structure in 6.5wt%Si-Fe Alloy and the Effect on Ductility, Journal of Materials Science Forum, vol. 492-493, pp. 59-62, 2005 [6] Feng Ye, Y.F.
%Si High Silicon Steel Sheets Produced by Cold Rolling, Journal of Materials Science Forum, vol. 492-493, pp. 59-62, 2005 [7] Y.

In refractory, forsterite is considered as one of the most efficient materials for critical production stages of modern iron and steel industry, namely, steelmaking and casting or ladle metallurgy [5-10].
Experimental Natural forsterite powders (44 μm, Yichang, China) and Na2CO3 (99.8% purity, AR) were used as raw materials.
Francis: Journal of Alloys and Compounds Vol. 113-115 (2010), p. 495 [5] R.
Markina: Aiche Journal Vol. 2832–2836 (11A) (1997), p. 43 [8] M.
West: Material Science and Technology Vol. 863–869 (9) (1995), p. 11 [10] Emad Mustafa, Nagy Khalil and Atef Gamal: Ceramics International Vol. 663–667 (2002), p. 28

First-Principles Calculation of Intermetallics on Novel Anode Materials Jin ZHANG1,a, Pei-xian ZHU1,b, Sheng-gang ZHOU1 and Jia-xin GUO1 1Faculty of Materials Science and Engineering, Kunming University of Science and Technology, Kunming 650093, China azhangjin819@hotmail.com, bzhu_pei_xian@163.com, Keywords: Sandwich structure, composite materials, diffusion sintering with pressing in vacuum, intermetallic compounds, first-principles calculation.
Our team proposes the design concept of layered composite electrode materials.
So we propose the design concept of layered composite electrode materials.
Computational Materials Science, 50(2011),p.1467-1476
Materials Science&Technology, 15(2007), p.47-51

Materials and Methods Materials.
China Building Materials.
Journal of materials science, 2011, 46(20): 6726
Journal of Wuhan University of Technology--Materials Science Edition, 2006, 21(1): 138-142
Journal of Building Materials, 2018,21(03):394-401.

Rahman1,2,a, Khaulah Sulaiman1,b, Mohamad Rusop3,c and Ahmad Shuhaimi1 1Low Dimension Materials Research Centre, University of Malaya, 50603, Kuala Lumpur, Malaysia 2Faculty of Applied Sciences, Universiti Teknologi MARA, 40450, Shah Alam, Selangor, Malaysia 3NANO-SciTech Centre, Institute Of Science, Universiti Teknologi MARA, 40450, Shah Alam, Selangor, Malaysia.
Xu, Free-Standing PEDOT-PSS/Ca3Co4O9 Composite Films as Novel Thermoelectric Materials, Journal of Electronic Materials 40 (2011) 948-952
Koenig, Markus Winkler, Harald Boettner, Organic Semiconductors for Thermoelectric Applications, Journal Of Electronic Materials 39 (2010) 1589-1592
Katz, F.Fang and R.l.Opila, Promising Thermoelectric Properties of Commercial PEDOT:PSS Materials and Their Bi2Te3 Powder Composites, Applied Materials and Interfaces 2 (2010) 3170-3178
Peng, The thermoelectric performance of Poly(3,4-ethylenedioxythiphene)/Poly(4-styrenesulfonate) thin films, Journal Of Electronic Materials 38 (2009) 1182-1188

Journal of Functional Materials and Devices, 2010 16 (3) 222-226
[6] Liu Rui, WANG Hong, Li XuePing, et al., A micro-tensile method for measuring mechanical Properties of MEMS materials, Journal of Micromechanics and Micro engineering. 18 (2008) 065002 [7] Liu Rui, Study Of Mechanical Properties of Micro-Scale Materials by Micro-Tensile System and Method, Shanghai Jiao Tong University, 2009
High strength and high ductility of electrodeposited nanocrystalline Ni with a broad grain size distribution, Materials Science and Engineering: A. 487 (2008) 410-416
Journal of Electrochemical Society. 153 (2006) 155-161
Materials Science and Engineering: A, Volumes 319–321 (2001) 882-886

Conventional thermal conductive filler include oxide materials, such as Al2O3, MgO, ZnO, etc; nitride materials, such as AlN, BN, Si3N4, etc; and carbide materials, such as SiC, B4C, etc.
Luo, Application of Thermally Conductive Filler in Insulating Polymer Materials, Insulating Materials. 46(2013) 26-28
Uno, Thermal conductivity of polymer filled with carbon materials: effect of conductive particle chains on thermal conductivity, Journal of Applied Polymer Science. 30(1985) 2225-2235
Journal of Applied Polymer Science, 16(2015) Web published DOI: 10.1002/APP.41889
Takezawa, Study of high thermal conductive epoxy resins containing controlled high-order structures, Journal of Applied Polymer Science. 9(2003) 2464-2467

awangbl2001@hotmail.com, bhanjc@hit.edu.cn Keywords: Functionally graded materials, Cracks, Fracture mechanics, Dynamic fracture mechanics Abstract.
Introduction In non-homogeneous materials such as functionally graded materials, the response has a strong dependence on the spatial variation of thermal and mechanical properties [1].
Conclusions A theoretical model is developed for the interactions of an array of cracks periodically located in functionally graded materials.
Miyamoto et al.: Functionally Graded Materials: Design, Processing and Applications.
Erdogan: International Journal of Engineering Science Vol.26 (1988), p. 559

It is used to machine the hard materials [4-7].
Garg, "Effects of process parameters on material removal rate in WEDM," Journal of Achievements in Materials and Manufacturing Engineering, Vol. 32, No. 1, pp. 70-74, 2009
Saghafian, "Evaluation of the mechanical properties of Niobium modified cast AISI H 13 hot work tool steel," Iranian Journal of Materials Science and Engineering, Vol. 7, No. 2, pp. 22-29, 2010
Senthilvelan, "Effect of electrode materials on Electric Discharge Machining of 316 L and 17-4 PH Stainless Steels," Journal of Minerals and Materials Characterization and Engineering, Vol. 11, No. 07, p. 685, 2012
Bhardwaj, "Review to EDM by using water and powder-mixed dielectric fluid," Journal of Minerals and Materials Characterization and Engineering, Vol. 10, No. 02, p. 199, 2011

Schematic diagram of chip formation in EVAC of a brittle material The chip thickness of brittle materials is usually very small.
As a property of brittle materials, fracture toughness expresses the ability of a material to resist the growth of a pre-existing crack or flaw.
Lim: Materials and Manufacturing Processes, Vol. 18 (2003), p. 825-834
Symposium on Micro-NanoMechatronics and Human Science, (2004), p. 133-138
Yasuto: Transactions of the ASME: Journal of Manufacturing Science and Engineering, Vol. 127 (2005), p. 522-532