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Electroless Plating of Silver on Microorganism Cells

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Abstract:

In this paper, microorganism cells (Spirulina platens) were used as forming templates for the fabrication of the helical functional particles with standard shape by electroless silver plating method. The cell form, components and the dielectric properties were observed and analyzed using various tools including optical microscopy, scanning electron microscopy (SEM), energy dispersive spectrometer (EDS) and vector network analyzer. The results indicate that the silver coatings on the surfaces of spirulina platensis cells are continuous and compact. The coating thickness of the cells increases with increasing plating time and load, in turn resulting in the increase of the dielectric constant. Furthermore, when the coating thickness is larger than 0.42μm, the samples exhibit significantly percolation phenomenon, indicating that the cells deposited silver form conductive network or electron tunneling in the composites.

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Periodical:

Advanced Materials Research (Volumes 197-198)

Pages:

531-535

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.197-198.531

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Online since:

February 2011

Authors:

Ming Ming Lan, De Yuan Zhang, Jun Cai, Wen Qiang Zhang, Hai Yang Li

Keywords:

Bio-Limited Forming, Dielectric Property, Electroless Plating (EP), Helical Particle, Microorganism Cell

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© 2011 Trans Tech Publications Ltd. All Rights Reserved

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