Description: Volume is indexed by Thomson Reuters BCI (WoS).
The 108 peer reviewed papers on “Mechatronic Systems and Materials” are grouped as follows:
I. Integrated Diagnostics;
II. Failure Analysis;
III. Tribology in Mechatronic Systems;
IV. Signal and Image Processing;
V. Measurement Techniques;
VI. Multifunctional and Smart Materials;
VII. Metallic Alloys;
VIII. Biomaterials;
IX. Functional Composites;
X. Nanomaterials; XI. Ceramics and Glasses;
XII. New Trends in Mechatronic and Materials Science Education.

Components, Packaging and Manufacturing Technology

Edited by: Yanwen Wu

Online since: January 2011

Description: Volume is indexed by Thomson Reuters CPCI-S (WoS).
The objective of this special collection is to provide a showcase for researchers, educators, engineers and government officials, involved in the general areas of Components, Packaging and Manufacturing Technology, by which to highlight the latest research results and to exchange views on the future direction of research in these fields. The topics covered include: Advanced Measurement, Test and Information Technology, Components, Packaging and Manufacturing Technology.