Books by Keyword: Genetic Algorithm (GA)

Description: This work brings together the latest applications of, and advances in, CAD/CAM/CAE, energy storage and energy development, mining machinery manufacturing, new energy equipment and manufacturing, cloud manufacturing and extreme manufacturing, bio-manufacturing, enterprise informationization, integrated manufacturing systems, quality monitoring and control of manufacturing processes, measurement control technologies and intelligent systems, embedded systems, etc. This broad overview of the latest advances also provides a reference source for researchers in this field.

Description: This book describes the latest advances in, and applications of, dynamic mechanical analysis, optimization and control, mechanical transmission theory and applications, mechanical reliability theory and engineering, theory and application of friction and wear, vibration, noise analysis and control, mechanical dynamics and its applications, heat and heat engineering, etc. It provides a comprehensive survey of the latest advance, and also constitutes a valuable reference source for researchers in this field.
Volume is indexed by Thomson Reuters CPCI-S (WoS).

Description: This special volume aims to bring together the latest advances in, and applications of, surface engineering/coatings, modeling, analysis and simulation, materials forming, materials machining, welding and joining, laser-processing technology, casting and solidification, precision manufacturing technology and measurements, etc. It will not only furnish readers with a broad overview of the latest advances, but also provide a valuable summary and reference work for researchers in this field.

Description: Volume is indexed by Thomson Reuters CPCI-S (WoS).
In this special collection of over 470 peer-reviewed papers are to be found many original ideas and new angles on aspects of industry, information systems and materials engineering. It offers a good basis upon which researchers can exchange their innovative ideas from a new perspective. In addition, the proceedings provide guidance for scientists, physicists, chemists, teachers, etc. all over the world.

Description: Volume is indexed by Thomson Reuters CPCI-S (WoS).
This book brings together 249 peer-reviewed papers on Mechatronics and Intelligent Materials in order to promote the development of those fields by strengthening international academic cooperation and communications, and by exchanging research ideas. It provides readers with a broad overview of the latest advances in the fields of mechatronics and intelligent materials and will be essential reading for those working in those areas.

Description: A forum for those researchers, educators, engineers, and government officials involved in the general areas of Materials, Mechatronics and Automation and sensors, was provided by this collection of peer-reviewed papers. The resultant dissemination of the latest research results, and the exchanges of views concerning the future research directions to be taken by these fields makes the work of immense value to all those having an interest in the topics covered.
Volume is indexed by Thomson Reuters CPCI-S (WoS).
The more than 387 papers are grouped into: Chapter 1: Intelligent Mechatronics, Robotics, Biomimetics, Automation, Chapter 2: Materials, Mechatronics and Automation, Chapter 3: Industrial Automation and Manufacturing Process.

Description: Volume is indexed by Thomson Reuters CPCI-S (WoS).
This special collection of over 292 peer-reviewed papers reflects the success of a high-level international forum for scientists, engineers, and educators which was aimed at presenting a state-of-the-art appreciation of measuring technology and mechatronics, automation research and their applications in diverse fields.

Description: Volume is indexed by Thomson Reuters CPCI-S (WoS).
The aim of this special volume is to facilitate the exchange of information concerning the best practice with regard to Advanced Intelligent Structures, Bio-Inspired Smart Materials and Structures, Active Materials, Mechanics and Behavior, Vibration and Control, Modeling, Simulation, Control and Applications, etc. It will provide an opportunity for engineers and scientists, in academia, industry and government, to address the most innovative research and new development, including technical challenges, social and economic issues, and to discuss their ideas, results, work-in-progress and experience concerning all aspects of Intelligent Structure and Vibration Control.

Description: Volume is indexed by Thomson Reuters CPCI-S (WoS).
This work brings together peer-reviewed papers on innovations and practical suggestions with regard to engineering & technology; materials science and technology in manufacturing including artificial materials, forming, novel-material fabrication, green manufacturing, design and manufacturing of composite components, surface science and engineering, quality control of manufacturing systems, theoretical, simulation and experimental studies related to microstructures and residual stresses; manufacturing systems and technologies including manufacturing process simulation, CIMS and manufacturing systems, vibration measuring and reliability analysis, finite element analysis and structure optimization, fault diagnosis and maintenance theory, intelligent mechatronics and robotics, elements, structures, mechanisms, and applications of micro and nano systems, compound machine tools, rapid prototyping, printing (e.g. embossing), complex mechanical-electro-liquid systems, PDM, ERP, CRM, FMS, PLM, logistics and supply chains, effect of the machining method or technique upon resultant material mechanical properties, RPM, and management.

Description: Volume is indexed by Thomson Reuters CPCI-S (WoS).
The objective of this special collection is to provide a showcase for researchers, educators, engineers and government officials, involved in the general areas of Components, Packaging and Manufacturing Technology, by which to highlight the latest research results and to exchange views on the future direction of research in these fields. The topics covered include: Advanced Measurement, Test and Information Technology, Components, Packaging and Manufacturing Technology.