Books by Keyword: Heat Transfer

Description: Volume is indexed by Thomson Reuters CPCI-S (WoS).
These 278 peer-reviewed papers selected from the SSITE International Conference on Future Material Research and Industry Application (FMRIA 2011), held on December 1-2, 2011, in Macau (China), are grouped into the chapters: industrial engineering and materials science, applied chemical engineering, mechanical engineering and computer science, biomaterials science and environmental engineering, applied mechanics and structural engineering. The work is an excellent guide to the current state-of-the art of these subjects.

Description: These are selected papers from the 2011 International Conference on Mechanical Engineering, Materials and Energy, ICMEME2011, held in Dalian. The papers reveal the latest developments, in the field of Mechanical Engineering, Materials and Energy … from fundamentals to new technologies and applications. In particular, they cover the topics of Mechatronics and Automation, Mechanical Manufacturing Systems, Signal Processing, Manufacturing Technology and Processing and Materials Science and Technology.

Description: Physical and numerical simulations make it possible for materials science to go from experience-based to science-based, and from qualitative to quantitative understanding. Physical simulations, which effectively reveal the underlying principles of a material’s structure and property evolution, save significant amounts of time and money. Numerical simulations meanwhile permit descriptions and forms of material processes which are impossible to achieve experimentally. Both types of simulation are naturally gaining acceptance worldwide, and will become a prominent approach used in materials research in the 21st century. Young researchers will therefore benefit greatly from studying this volume.

Description: Volume is indexed by Thomson Reuters CPCI-S (WoS).
In this collection of peer-reviewed papers are to be found original ideas and new points of view on aspects of materials engineering, architectural engineering and informatization. Herein, researchers exchange innovative ideas from new perspectives; thus providing guidance to scientists, physicists, chemists, teachers and others worldwide.

Description: The extensively peer-reviewed contents of this book cover the topics of engineering thermophysics, thermal engineering, power machinery and engineering, fluid machinery and engineering, HVAC, air-conditioning and refrigeration, power systems and automation, high-voltage and insulation technology, electrical theory and new technology, power electronics and power drives. The work is an invaluable guide to these subjects

Description: Volume is indexed by Thomson Reuters CPCI-S (WoS).
This special volume brings together the latest advances in, and applications of, mechatronics and materials processing. It comprises 523 papers selected from the some 1000 papers originally submitted by universities and industrial concerns all over the world. The papers specifically cover the topics of manufacturing technology and processing, materials science and technology, mechatronics and automation. All of the papers were peer-reviewed, by selected experts, and chosen for their quality and relevance. This work will provide readers with a broad overview of the latest advances in the field of mechatronics and materials processing. It will also constitute a valuable reference work for researchers in the fields of mechatronics and materials processing.

Description: In these proceedings are to be found original ideas and new perspectives on aspects of Materials Science, Environmental Science and Computer Science. They are the outcome of a forum which permitted researchers to exchange innovative ideas from a refreshing point of view. The proceedings will also provide guidance to scientists, physicists, chemists, teachers and others all over the world.
Volume is indexed by Thomson Reuters CPCI-S (WoS).

Description: Volume is indexed by Thomson Reuters CPCI-S (WoS).
The International Conference on Key Engineering Materials and Computer Science (KEMCS 2011), held in Dalian, China, was the first conference to be dedicated to issues related to key engineering materials and computer science. A major goal and feature of KEMCS 2011 was to bring together academics, engineers and industrial researchers in order to exchange and share their experiences and research results touching most aspects of key engineering materials and computer science, and to discuss the practical challenges encountered and the solutions adopted. This work clearly makes a valuable contribution to the field.

Description: The goal of this special collection of peer-reviewed papers was to provide an unique opportunity to exchange information, to present the latest results and to review relevant issues in contemporary diffusion research. The result is a work which will provide valuable insights into this subject.
Volume is indexed by Thomson Reuters CPCI-S (WoS)

Description: This collection of 338 peer-reviewed papers, in a two-volume format, brings together the latest advances and applications of robotics, artificial intelligence, programmable controllers, lasers and other advanced processes, programmable assembly, flexible manufacturing systems, inspection; automatic test equipment, simulation, motors, controls and drives, local area networking, computer-integrated manufacturing, production planning and control, logistics and supply-chain management, human factors, and economics.