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Books by Keyword: Packaging Materials
Books
Edited by:
Prof. Jong Wan Hu
Online since: February 2025
Description: The 7th International Conference on Material Engineering Research (ICMER 2024) took place in Jeju Island, South Korea, on April 19-21, 2024. The primary objective of ICMER 2024 was to provide a world-class forum for exchanging new information and the latest research results, exploring collaborations and sparking new ideas, with the aim of developing new projects and exploiting new technology in the field of applied materials and advanced materials processing technologies. The meeting brought together academics, scientists, engineers, postgraduates and other professionals in the area of material science and engineering technology from all over the world.
Edited by:
Dechang Xi, Guoqiang Cai, Zhenlin Wang and De Gao
Online since: October 2012
Description: These are the proceedings of the International Conference on Packaging Technology and Science (ICPTS 2012), held on October 25-28th 2012 in Ningbo, China.
Volume is indexed by Thomson Reuters CPCI-S (WoS).
The 161 peer-reviewed papers are grouped into 5 chapters:
Applied Mechanics of Packaging;
Packaging Materials;
Packaging Technology and Equipment;
Packaging Design Methods;
Packaging Printing
Volume is indexed by Thomson Reuters CPCI-S (WoS).
The 161 peer-reviewed papers are grouped into 5 chapters:
Applied Mechanics of Packaging;
Packaging Materials;
Packaging Technology and Equipment;
Packaging Design Methods;
Packaging Printing
Showing 1 to 2 of 2 Books