Engineering Research
Materials Science
Engineering Series
Books by Keyword: Piezoelectric
Books
The papers presented and reviewed in this volume are cover up-to-date fundamental research, innovative top-down and bottom-up methods and technologies towards the development of nanodevices. The effort to share and churned new knowledge in this field are geared towards enhancement and efficient energy conversion, conservation of natural resources, reduction of pollution and overall improvement in quality of life.
The present volume contains 175 selected papers from the 4th International Conference on Ultrafine-Grained and Nano-structured Materials (UFGNSM2013). This is the fourth biennial conference in UFGNSM series, jointly organized by Center of Excellence for High Performance Materials (CEHPM), University of Tehran, IRAN and University of Patras, GREECE. This volume presents a selection of papers submitted to the conference from universities and industries. These papers cover various aspects of ultrafine grained and nanostructured materials including: novel approaches to produce ultrafine grained and nanostructured materials and related properties, nanoparticles processing, nanostructure control, nanocomposites, nanocoatings and thin films, ultrafine grains and nanostructures characterization, simulation and modeling, and energy applications.
The 266 papers are grouped as follows:
Chapter 1: Materials and Chemical Engineering;
Chapter 2: Composite Materials, Machining & Processing;
Chapter 3: Control and Detection Systems;
Chapter 4: Data Processing;
Chapter 5: Modeling, Analysis, and Simulation of Manufacturing;
Chapter 6: Computer-Aided Design, Manufacturing, and Engineering;
Chapter 7: Manufacturing Process Planning and Scheduling;
Chapter 8: Environmentally Sustainable Manufacturing Processes and Systems.
Volume is indexed by Thomson Reuters CPCI-S (WoS).
The collection covers 54 peer reviewed papers covering up-to-date research results in structural health monitoring.
The development of new materials with specific properties is discussed such as metal hydride systems. Other active areas of research include in this volume is the surface engineering to locally enhance properties: electro deposition, electrostatic spray assisted vapor deposition (ESAVD) and aerosol assisted chemical vapor deposition. This includes creating metallic glass coatings with high strength and corrosion resistance, cermet coatings with good wear resistance, as well as functional thin films and Nano composite coatings. The work presented here is characterized by a synthesis of experimental research and numerical modeling of the mechanical behavior of materials at different length scales, and the application of models developed to analyze structural parts.
International Conference on Engineering Materials for Electronics, Communication and Construction 2012 (EMECC 2012) was held on Aug. 25-26, 2012, Hangzhou, China. EMECC was initially created by a network of researchers and engineers both from academia and industry in the areas of material science and mechanics engineering. The goal of EMECC 2012 is to bring together researchers from the academia and practitioners from the industry in order to address fundamentals and applications of material science and mechanics. The conference provides a forum where researchers shall be able to present recent research results and new research problems and directions related to them. The conference seeks contributions presenting novel research in all aspects of new advanced methods for material science and mechanics.
The volume contains selected, peer reviewed papers from the 2012 International Conference on Advances in Materials Science and Engineering (AMSE 2012), December 9-10, 2012, Seoul, Korea.
The papers are grouped as follows:
Chapter 1: Materials Engineering;
Chapter 2: Mechanical Engineering;
Chapter 3: Mechatronics and Control;
Chapter 4: Manufacturing Processes;
Chapter 5: Civil and Environmental Engineering;
Chapter 6: Product Design and Engineering Management.
Volume is indexed by Thomson Reuters CPCI-S (WoS).
The papers are conveniently arranged into: Chapter 1: Smart Materials, Sensors, Actuators, MEMS, Chapter 2: Integration Technologies, Chapter 3: Smart Structures and Integrated Systems, Chapter 4: Structural Health Monitoring and Control.
The main objective of this volume is to present the current understanding of leading researchers, engineers and scientists - from Romania and from around the world - concerning these fields in order to provide a platform from where researchers, engineers, academicians as well as industrial professionals can present their latest experiences and developmental activities in the mechanical engineering, manufacturing systems, robotics, medical and military fields.