Books by Keyword: Porthole Extrusion Dies

Description: The International Conference on Extrusion and Benchmark was held for the fourth time. Invited keynote speakers and contributors from academia and industry reported on the latest advances in extrusion technology and its simulation.
Volume is indexed by Thomson Reuters CPCI-S (WoS).
The contributions covered a wide range of topics and are grouped into the categories of: benchmark, microstructure, seam welds & composite extrusion, material flow & constitutive equations, friction evaluation, dies & tools, and process control & optimization. However, many more topics such as new materials and new profiles have also been covered.