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Books by Keyword: Principal Component Analysis (PCA)
Books
Edited by:
Shaobo Zhong, Yimin Cheng and Xilong Qu
Online since: February 2011
Description: Volume is indexed by Thomson Reuters CPCI-S (WoS).
The aim of this special volume is to facilitate the exchange of information concerning the best practice with regard to Advanced Intelligent Structures, Bio-Inspired Smart Materials and Structures, Active Materials, Mechanics and Behavior, Vibration and Control, Modeling, Simulation, Control and Applications, etc. It will provide an opportunity for engineers and scientists, in academia, industry and government, to address the most innovative research and new development, including technical challenges, social and economic issues, and to discuss their ideas, results, work-in-progress and experience concerning all aspects of Intelligent Structure and Vibration Control.
The aim of this special volume is to facilitate the exchange of information concerning the best practice with regard to Advanced Intelligent Structures, Bio-Inspired Smart Materials and Structures, Active Materials, Mechanics and Behavior, Vibration and Control, Modeling, Simulation, Control and Applications, etc. It will provide an opportunity for engineers and scientists, in academia, industry and government, to address the most innovative research and new development, including technical challenges, social and economic issues, and to discuss their ideas, results, work-in-progress and experience concerning all aspects of Intelligent Structure and Vibration Control.
Edited by:
Yanwen Wu
Online since: January 2011
Description: Volume is indexed by Thomson Reuters CPCI-S (WoS).
The objective of this special collection is to provide a showcase for researchers, educators, engineers and government officials, involved in the general areas of Components, Packaging and Manufacturing Technology, by which to highlight the latest research results and to exchange views on the future direction of research in these fields. The topics covered include: Advanced Measurement, Test and Information Technology, Components, Packaging and Manufacturing Technology.
The objective of this special collection is to provide a showcase for researchers, educators, engineers and government officials, involved in the general areas of Components, Packaging and Manufacturing Technology, by which to highlight the latest research results and to exchange views on the future direction of research in these fields. The topics covered include: Advanced Measurement, Test and Information Technology, Components, Packaging and Manufacturing Technology.
Edited by:
Qi Luo
Online since: January 2010
Description: The objective of this special collection was to provide a outlet for researchers, educators, engineers and government officials, involved in the general areas of Intelligent Manufacturing, Manufacturing Systems and Processes, Modeling and Simulation, to disseminate their latest research results and exchange views on the future research directions of these fields.