Books by Keyword: Soldering

Description: This special edition presents research and development results in important areas of materials science and will be a useful referential resource for many specialists.

Description: This book presents full text peer-reviewed papers presented at the THERMEC 2023, the 12th International Conference on Processing and Manufacturing of Advanced Materials, which took place between July 03 and July 07, 2023, in Vienna, Austria, under the co-sponsorship of TU Wien and Graz University of Technology. The Conference was also under the auspices of professional organizations from Japan, Korea, France, Italy, The Netherlands, Germany, Brazil, Austria, India, and Canada. The Conference brought together researchers and engineers/technologists working in different aspects of processing, fabrication, structure/property evaluation and applications of both, ferrous and nonferrous materials including biomaterials, smart/intelligent materials as well as advanced characterisation techniques.

Description:

The 12th TIMA21 which was held in Timișoara, Romania, by videoconference (November 25-26, 2021), paid particular attention to practical problems in the area of new joining technologies, mechanical and structural characterization of advanced materials and joints, corrosion and assessment of damage state. The volume includes selected papers in which the authors reveal the results of their own research and development activity, carried out in the frame of their institutes, universities and economic field from Romania, Hungary, Serbia, Ukraine, Bulgaria, and Latvia.

Description:

This issue introduces the latest results of research and engineering solutions in the field of applied materials science and modern materials welding and processing technologies, and will be helpful for many specialists in mechanical engineering, electronics and construction.

Description:

Conventional and non-conventional welding technologies, microstructure and mechanical properties of welded connections, technologies of dissimilar joints, bonding and soldering processes, electrochemical processes in fuel cells and biobased corrosion inhibitors are the topics of this volume. Collected articles will be interesting for engineers and researchers in machinery and electrochemical engineering.

Description: This volume contains papers presented at the 10th International Conference on Advanced Materials and Engineering Materials (ICAMEM 2021), which took place on May 29-30, 2021 (virtual) and the 7th International Conference on Mechanical Structures and Smart Materials (ICMSSM 2021, June 14-15, 2021, in Changsha, China). Collected papers reflect the latest achievements in the field research of materials properties and development and analysis technologies of theirs processing.

Description: The International Conference on Advanced Material Engineering & Technology (ICAMET 2015) is the premier forum for the presentation of new advances and research results in the fields of Advanced Material Engineering and Technology. This book covers the entire range of basic and applied aspects of the synthesis and characterization, modelling, processing and application of advanced engineering materials including construction materials, coating, semiconductor and biotechnology.

Description: Volume is indexed by Thomson Reuters BCI (WoS).
This monograph deals with a physico-chemical approach to the problem of the solid-state growth of chemical compound layers and reaction-diffusion in binary heterogeneous systems formed by two solids; as well as a solid with a liquid or a gas. It is explained why the number of compound layers growing at the interface between the original phases is usually much lower than the number of chemical compounds in the phase diagram of a given binary system. For example, of the eight intermetallic compounds which exist in the aluminium-zirconium binary system, only ZrAl3 was found to grow as a separate layer at the Al–Zr interface under isothermal conditions. The physico-chemical approach predicts that, in most cases, the number of compound layers should not exceed two; with the main factor, resulting in the appearance of additional layers, being crack formation due to thermal expansion and volume effects.