Books by Keyword: Surface

Description: Volume is indexed by Thomson Reuters CPCI-S (WoS).
Collection of selected, peer reviewed papers from the 16th International Conference on Advanced Materials and Processing Technologies (AMPT 2013), September 22-26, 2013, Taipei, Taiwan.
The 92 papers are grouped as follows:
I. Material Science and Processing,
II. Advanced Machining,
III. Geometry Analysis and Forming,
IV. Forming Processes,
V. Forming with Temperature Influence,
VI. Surface and Precision Engineering,
VII. Computer Aided Engineering,
VIII. Automation and Manufacturing Systems,
IX. Micro/Nano Technology

Description: Collection of selected, peer reviewed papers from the 2014 4th International Conference on Advanced Materials Research (ICAMR 2014), January 22-23, 2014, Macau, China.
The 82 papers are grouped as follows:
Chapter 1: Composite Materials,
Chapter 2: Materials for Civil Engineering Applications,
Chapter 3: Materials Engineering and Processing Technologies,
Chapter 4: Chemical Engineering and Biotechnological Research,
Chapter 5: Nanotechnology, Nano-Materials and Nano-Composites,
Chapter 6: Thin Films Research and Trends in Electronics

Description: Volume is indexed by Thomson Reuters CPCI-S (WoS).
Collection of selected, peer reviewed papers from the 2013 2nd International Conference on Material Science and Engineering Technology (ICMSET 2013), November 16-17, 2013, London, United Kingdom.
The 72 papers are grouped as follows:
Chapter 1: Composite Materials;
Chapter 2: Chemical Materials and Technologies;
Chapter 3: Modelling and Analysis of Materials Properties and Technologies;
Chapter 4: Nanomaterials and Nanotechnologies;
Chapter 5: Advances in Energy Technology;
Chapter 6: Applied Mechanics and Mechanical Engineering

Description: This collection of papers provides the most up-to-date information available for researchers and engineers who are interested in any aspect of the field of precision machining. The book includes papers from fields of precision machining and processes as well as related topics such as tools, methods, quality assurance and logistics. The major goal is to search for methods for providing increased endurance and reliability of products at reduced production and assembly cost.
Volume is indexed by Thomson Reuters CPCI-S (WoS).
The contents are presented under the headings of:
I. Cutting Tools;
II. Machining Processes;
III. Hard Machining;
IV. Abrasive Machining;
V. Non-conventional Machining;
VI. Analysis of Surfaces; Machininf Accuracy; VIII. Process Modelling and Simulation;
IX. Production Processes

Description: Volume is indexed by Thomson Reuters CPCI-S (WoS).
The 2012 International Conference on Computer-Aided Material and Engineering (ICCME 2012) was held on the 17 and 18th March, 2012, in Hangzhou, China. The papers are divided into: Chapter 1: Mechanics Applications; Chapter 2: Materials - Study, Modeling and Technologies; Chapter 3: Material Engineering; Chapter 4: Applied Mechanics and Mechanical Engineering.

Description: The main goal of these proceedings was to demonstrate the use of a variety of multi-scale approaches, ranging from the atomistic to the macroscopic, and in this it succeeds admirably. The special collection includes more than 130 peer-reviewed papers on atomistic, mesoscopic, macroscopic and multiscale approaches.

Description: Volume is indexed by Thomson Reuters CPCI-S (WoS).
No present-day research and development program is complete without the inclusion of a robust modeling and numerical simulation component. Models and model-based numerical simulations are extensively used to probe complex materials behavior and structure in order to obtain a deeper insight into the fundamentals of materials. Multi-physics models are becoming increasingly common, with advances in computational science, and are rapidly advancing the basic understanding of materials.

Description: Volume is indexed by Thomson Reuters CPCI-S (WoS).
The 20th century was a period during which many new sciences and engineering techniques appeared and evolved, and were applied to industrial applications. Towards the end of that century, however, it was recognized that - in many cases - the industrial technologies that underpin current-day society suffered from wider sociogical deficiencies. The usual engineering approaches began to face many difficulties which arose from the high habitual levels of consumption of energy and resources.. Energy sources, and supplies of various resources, have already begun to diminish in the 21st century. These limitations on energy and resources require science and technology to adapt quickly to this new regimen.

Description: Modern semiconductor devices rely upon precise defect engineering. On the one hand: defects are the components needed to generate the electronic architecture of the device. On the other hand: they may – if not carefully controlled– induce failure of that device. During the past fifty years, the electrical and optical properties of defects, their generation, transport, clustering and reactions between them have been investigated intensively. Yet the development of semiconductor technology remains closely connected to the advances made in defect science and engineering. Compared to metals, defect control in silicon is significantly complicated by the open structure of its lattice. As a result, reactions between defects, even at room temperature, have become a central issue in defect engineering.

Description: For one and a half decades, the application of positron annihilation to condensed-matter physics concentrated on the study of the Fermi surfaces of metals and alloys. As other, often more powerful, techniques for performing this type of study were developed, it appeared that condensed-matter positron physics was going to be relegated to being a niche interest. However, the situation changed dramatically when it was found that measurements of positron annihilation in metals were sensitive to the structures of well-known defects. This discovery, and subsequent research made it a major tool in materials science.
Volume is indexed by Thomson Reuters CPCI-S (WoS).