Description: Volume is indexed by Thomson Reuters CPCI-S (WoS).
The objective of this special collection is to provide a showcase for researchers, educators, engineers and government officials, involved in the general areas of Components, Packaging and Manufacturing Technology, by which to highlight the latest research results and to exchange views on the future direction of research in these fields. The topics covered include: Advanced Measurement, Test and Information Technology, Components, Packaging and Manufacturing Technology.

Advanced Measurement and Test X

Edited by: Yanwen Wu

Online since: June 2010

Description: This special collection on Advanced Measurement and Test is dedicated to the electronic testing of devices, boards and systems and covers the complete cycle: from design verification, design-for-testing, design-for-manufacturing, silicon debug, manufacturing test, system test, diagnosis, failure analysis and back to process and design improvement. Design, testing and yield professionals were invited to confront the challenges which the industry faces, and to learn how these challenges are being addressed by the combined efforts of academia, design tool and equipment suppliers, designers and test engineers.