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11th International Congress Molded Interconnect Devices – Scientific Proceedings
Description:
Collection of selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany.
The 16 papers are grouped as follows:
Chapter 1: Development and Prototyping,
Chapter 2: Printing Technologies,
Chapter 3: Materials and Manufacturing,
Chapter 4: Manufacturing Processes,
Chapter 5: Assembly Technologies and Inspection,
Chapter 6: Quality and Reliability.
The 16 papers are grouped as follows:
Chapter 1: Development and Prototyping,
Chapter 2: Printing Technologies,
Chapter 3: Materials and Manufacturing,
Chapter 4: Manufacturing Processes,
Chapter 5: Assembly Technologies and Inspection,
Chapter 6: Quality and Reliability.
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Info:
eBook:
ToC:
Editors:
Jörg Franke, Thomas Kuhn, Albert Birkicht and Andreas Pojtinger
THEMA:
PHV, TGB, TGM
BISAC:
TEC000000
Keywords:
Details:
Selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany
Pages:
130
Year:
2014
ISBN-13 (softcover):
9783038352525
ISBN-13 (CD):
9783037959480
ISBN-13 (eBook):
9783038266365
Permissions CCC:
Permissions PLS:
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Review from Ringgold Inc., ProtoView:
The 16 papers collected here are from the 11th International Congress Molded Interconnect Devices (MID 2014), held in September 2014 in Nuremberg/Fuerth, Germany. Technology specialists from Europe, the US, and Taiwan address development and prototyping, printing technologies, materials and manufacturing, manufacturing processes, assembly technologies and inspection, and quality and reliability.
Ringgold Subjects:
— Electronic components and devices
— Electronic engineering
— Materials science