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These proceedings of the 2nd International Conference on Advanced Materials and Information Technology Processing (AMITP 2012), held on the 17 and 18^th October 2012 in Taipei, Taiwan, hold to the theme of "Materials Science, Mechanical Science and Information Technology". The objective of the conference was to bring together researchers from academia and industry, as well as others, in order to share ideas, problems and solutions related to Advanced Materials and Information Technology Processing.

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Info:

eBook:

View eBook preview

ToC:

Table of contents

Editors:

Junqiao Xiong

DOI:

https://doi.org/10.4028/b-ZD3zs7

THEMA:

PHV, TBC, TGM

BISAC:

TEC021000

Keywords:

Buffer Layer, Cement, Compressive Strength, Correction Method, Field Emission, Finite Element Method (FEM), Friction, Glutamate Decarboxylase, Heat Treatment, Mechanical Property, Microstructure, Nanoparticle, Network Parameter, Neural Network (NN), Optical Device, Plastic Bending, Polyphenol, Semiconductor Material, Stainless Steel (SS), Transfer Matrix Method (TMM)

Details:

Selected, peer reviewed papers from the 2012 2nd International Conference on Advanced Materials and Information Technology Processing (AMITP 2012), October 17-18, 2012, Taipei, Taiwan

Pages:

470

Year:

2012

ISBN-13 (softcover):

9783037855232

ISBN-13 (CD):

9783037953297

ISBN-13 (eBook):

9783038134497

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Review from Ringgold Inc., ProtoView: The themes of the conference were material science, mechanical science, and information technology. The 76 papers discuss such topics as different activities of osteoblast and bacteria on a nanostructured titanium surface for dental implant, investigating the dynamic response of functionally graded materials using smoothed particle hydrodynamics, the influence of mineral aggregate gradations and spatial distribution on the performance of asphalt mixtures, feature selection of sudden failure based on affinity propagation clustering, analyzing the durability of the reduction gear for high speed trains considering driving histories, the finite element analysis of the mobile plate electrostatic precipitator wide column parts, and an ellipsoidal tool as a nanoscale removal processor for computer and digital systems.