Advanced Materials and Processes II

Advanced Materials and Processes II

Subtitle:

CEAM 2012

Description:

These 507 peer-reviewed papers are grouped into the chapters: Non-Ferrous Metal Materials; Iron and Steel; Composites; Micro/Nano Materials; Optical/Electronic/Magnetic Materials; Building Materials and Structural Mechanics; New Materials and their Application; Energy Materials and Energy Storage Materials; Material Forming, Machining and Joining; Material Preparation, Properties and Failure; Thin Films/Surface Engineering/Coatings; Computer Application, Mathematical Modeling and Analysis; Modeling, Simulation and Emulation; Product Design, Manufacturing and Maintenance. This compilation offers invaluable insights into current thinking concerning materials usage.

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Info:

Editors:
Hongbing Ji, Yixin Chen and Shengzhou Chen
THEMA:
PHV, TGM
BISAC:
TEC021000
Details:
Selected, peer reviewed papers from the 2nd International Conference on Chemical Engineering and Advanced Materials (CEAM 2012), July 13-15, 2012, Guangzhou, China
Pages:
2514
Book Set:
3 Books set
Year:
2012
ISBN-13 (softcover):
9783037854570
ISBN-13 (CD):
9783037952740
ISBN-13 (eBook):
9783038138716
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Permissions PLS:
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Review from Ringgold Inc., ProtoView: This set consists of three volumes of papers from the Second International Conference on Chemical Engineering and Advanced Materials (CEAM 2012), held in July 2012 in Guangzhou, China. Written by engineers, materials scientists, and others mainly from China, the 507 papers detail new developments, recent progress, and innovations in the chemical engineering and advanced materials fields, with an emphasis on current and future challenges in research and development in academia and industry. They address non-ferrous metal materials; iron and steel; composites; micro/nano materials; building materials and structural mechanics; optical/electronic/magnetic materials; new materials and applications; energy and energy storage materials; intelligent materials and systems; material forming, machining, and joining; material preparation, properties, and failure; thin films/surface engineering/coatings; computer applications, mathematical modeling, and analysis; modeling, simulation, and emulation; and product design, manufacturing, and maintenance.