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Advanced Micro-Device Engineering III
Description:
Volume is indexed by Thomson Reuters CPCI-S (WoS).
The aim of this volume is to accelerate the exchange of information on the best practices for CAD, CAM, Manufacturing, Mechanical Engineering, Modeling and Simulation, etc. Engineers and scientists in academia, industry and government here address the most innovative research and development work, including technical challenges and social and economic issues, and discuss their ideas, results, work-in-progress and experience concerning all aspects of Computer-Aided Design, Manufacturing, Modeling and Simulation.
The aim of this volume is to accelerate the exchange of information on the best practices for CAD, CAM, Manufacturing, Mechanical Engineering, Modeling and Simulation, etc. Engineers and scientists in academia, industry and government here address the most innovative research and development work, including technical challenges and social and economic issues, and discuss their ideas, results, work-in-progress and experience concerning all aspects of Computer-Aided Design, Manufacturing, Modeling and Simulation.
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Info:
eBook:
ToC:
Editors:
Sumio Hosaka
THEMA:
PDT, TBC, TGM
BISAC:
TEC021000
Keywords:
AC Electric Field, Boric Acid, Cobalt, Compton Profile, Crystal Growth, Dc-Dc Converter, Dielectrophoresis, Elasticity, Electron Beam Lithography, FIB, Gold, Ion Milling, MnZn Ferrite, Multilevel Storage, Patterned Media, Phase Change Memory, Saccharomyces cerevisiae (Bakers Yeast), Shear Elastic Wave, Sputtering, Time-Domain Signal Processing
Details:
Selected, peer reviewed papers from the 3rd International Conference on Advanced Micro-Device Engineering (AMDE 2011), December, 8th, 2011, Kiryu City Performing Arts Center, Kiryu, Japan
Pages:
274
Year:
2013
ISBN-13 (softcover):
9783037855393
ISBN-13 (CD):
9783037953358
ISBN-13 (eBook):
9783038139201
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Review from Ringgold Inc., ProtoView:
The result of a conference that took place in December 2011 in Kiryu, Japan, this work contains 45 relatively short papers on subjects ranging from the use of materials science in constructing micro-devices to their use in medical engineering. All of the carefully selected papers were subjected to peer review.