Engineering Research
Materials Science
Engineering Series
Advances in Semiconducting Materials
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Volume is indexed by Thomson Reuters CPCI-S (WoS).
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Review from Ringgold Inc., ProtoView:
Consists of 23 papers presented at the semiconductor material symposium held during the October 2007 international materials research congress in Cancun. The contributors share recent advances in semiconductor properties, characterization techniques, surface preparation, passivation and cleaning, quantum semiconductor devices, nitride semiconductors, and computer simulation in condensed matter. Topics include microstructure formation of Al-Fe-Mn-Si aluminides by pressure-assisted reactive sintering of powders, structural transformation of boron nitride powders, impedance response of franklinite films to humidity and propane, and friction stir linear welding of an aluminum alloy. Black and white micrographs and photographs are provided.