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Industrial Processes of Multi-Material Assembly
Description:
The innovative assembly and materials junction processes result in multi-materials components with different mechanical behavior, with various electrical and optical properties must meet the technological challenges to improve product performance, relief structures, reducing cycle times and process control. The research efforts are principally focused on the effect of the forming parameters of very diverse processes (forming, solid phase (friction) or liquid (TIG, SMAW, etc.) brazing and additive manufacturing, materials implantation and deposition) on the microstructural aspect of the junction ensuring the cohesion and required properties of the resulting multi-material assemblies.
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Info:
eBook:
ToC:
Editors:
Prof. Mosbah Zidani and Dr. Hichem Farh
THEMA:
TGM, TGP
BISAC:
TEC009060, TEC021000
Keywords:
Alloys, Anisotropic Elastic Properties, Compounds, Crystalline Phases, Diffusion Bonding, Electronics Properties, Friction Stir Welding, Metal Oxides, Metal Powder Addition, Micro-Hardness, Microstructure, Optic Properties, Phase Change Materials, Semiconductors, Shielded Metal Arc Welding, Steel, Thermal Stress
Details:
Special topic volume with invited peer reviewed papers only
Pages:
220
Year:
2019
ISBN-13 (softcover):
9783035715705
ISBN-13 (CD):
9783035725704
ISBN-13 (eBook):
9783035735703
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Ringgold Subjects:
Materials Science, Building Materials, Industrial Engineering