Material Engineering and Application

Material Engineering and Application

Subtitle:

3rd International Conference on Material Engineering and Application (3rd ICMEA 2018)

Description:

This volume contains papers presented at the 3rd International Conference on Material Engineering and Application (3rd ICMEA 2018) which took place in Hong Kong during August 10-12, 2018. We hope that this collection will be interesting for many researchers, technologists, and engineers whose activity related to modern materials science and technologies of materials processing in the various fields of the manufacture.

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Info:

Editors:
Prof. Mosbeh Kaloop and Jongwan Hu
THEMA:
TGB, TGM
BISAC:
TEC009070, TEC021000
Details:
Selected, peer reviewed papers from the 3rd International Conference on Material Engineering and Application (3rd ICMEA 2018), August 10-12, 2018, Hong Kong, China
Pages:
242
Year:
2018
ISBN-13 (softcover):
9783035713831
ISBN-13 (CD):
9783035723830
ISBN-13 (eBook):
9783035733839
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Ringgold Subjects:

Materials Science