Mechanical and Electronics Engineering III

Mechanical and Electronics Engineering III

Description:

Volume is indexed by Thomson Reuters CPCI-S (WoS).
These peer-reviewed proceedings comprise the papers presented at a conference whose main theme was Mechanical and Electronics Engineering. The main goal of the event was to provide an international scientific forum for the exchange of new ideas in a number of fields and for in-depth interaction via discussions with peers from around the world. Core areas of Information and Network Technology, plus multidisciplinary, interdisciplinary and applied aspects were covered.

Purchase this book:

eBook
978-3-03813-718-4
$198.00 *
Print
978-3-03785-286-6
eBook+Print
978-3-03785-286-6
$673.60 *
* 1-User Access (Single User-Price). For Multi-User-Price please fill a contact form

Info:

Editors:
Han Zhao
THEMA:
TGB
BISAC:
TEC009070
Details:
Selected, peer reviewed papers from the 2011 3rd International Conference on Mechanical and Electronics Engineering (ICMEE 2011), September 23-25, 2011, Hefei, China
Pages:
4760
Book Set:
5 Books set
Year:
2012
ISBN-13 (softcover):
9783037852866
ISBN-13 (CD):
9783037951118
ISBN-13 (eBook):
9783038137184
Permissions CCC:
Permissions PLS:
Share:

Review from Ringgold Inc., ProtoView: Five hefty volumes contain the proceedings of ICMEE 2011, the third International Conference on Mechanical and Electronics Engineering, held in September in Hefei, China. Many hundreds of papers are arranged according to 69 broad themes. A sampling of general topics: material engineering, acoustics and noise control, aerodynamics, ballistics, biomechanics, biomedical engineering, internal combustion engines, material science and processing, nanomaterials, new and renewable energy, noise and vibration, heat and mass transfer, computational techniques, optoelectronics, and sensors. An index and an author list are included in the fifth volume.