Mechanical and Electronics Engineering VI

Mechanical and Electronics Engineering VI

Description:

Collection of selected, peer reviewed papers from the 2014 6th International Conference on Mechanical and Electronics Engineering (ICMEE 2014), August 16-17, 2014, Beijing, China.
Volume is indexed by Thomson Reuters CPCI-S (WoS).
The 80 papers are grouped as follows:
Chapter 1: Advanced Materials Engineering and Processing Technologies,
Chapter 2: General Mechanical Engineering and Applied Mechanics,
Chapter 3: Power Engineering,
Chapter 4: Power Electronics and Electrical Engineering,
Chapter 5: Mechatronics, Robotics and Control,
Chapter 6: Measurements and Sensors,
Chapter 7: Signal and Image Processing, Data Mining and Computational Mathematics,
Chapter 8: Communication, Networks and Information Technologies,
Chapter 9: Product Design and Industrial Engineering

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Info:

Editors:
Zhiming Liu
THEMA:
PHV, TGB, TGM
BISAC:
TEC000000
Details:
Selected, peer reviewed papers from the 2014 6th International Conference on Mechanical and Electronics Engineering (ICMEE 2014), August 16-17, 2014, Beijing, China
Pages:
428
Year:
2014
ISBN-13 (softcover):
9783038352624
ISBN-13 (CD):
9783037959589
ISBN-13 (eBook):
9783038266464
Permissions CCC:
Permissions PLS:
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Review from Ringgold Inc., ProtoView: Liu presents students, academics, researchers, and professional engineers in mechanical and electronic engineering with a collection of peer-reviewed selections from the papers presented at the sixth International Conference on Mechanical and Electronics Engineering, held August of 2014 in Beijing, China. The material collected in this volume is organized in nine chapters, covering advanced materials engineering and processing technologies, general mechanical engineering and applied mechanics, power engineering, power electronics and electrical engineering, mechatronics, robotics and control, measurements and sensors, signal and image processing, data mining, and computational mathematics, communication, networks, and information technologies, and product design and engineering.

Ringgold Subjects:

— Electronics
— Engineering -- Electrical
— Mechanical engineering