Engineering Research
Materials Science
Engineering Series
Mechatronics and Applied Mechanics II
Description:
Volume is indexed by Thomson Reuters CPCI-S (WoS).
The papers are grouped as follows:
Chapter 1: Manufacturing Technology and Processes, Design, Modelling, Simulation and Mechanical Engineering;
Chapter 2: Robotic, Automation, Sensors, Detection and Monitoring Technologies;
Chapter 3: Development Elecrtonics, Networks, Information Technology and Algorithms in Systems Applications;
Chapter 4: Mechanics, Thermal and Dynamics Systems, Vibration, Noise, Applied Mechanics and Numerical Simulation Applications;
Chapter 5: Materials Science and Technology, Material Manufacturing Processes;
Chapter 6: Control System Modeling and Applications;
Chapter 7: Developments in Medical Technologies and Images Processing Technologies.
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Review from Ringgold Inc., ProtoView:
This two-volume collection includes selected papers from the 2nd International Conference on Mechatronics and Applied Mechanics held in Hongkong and Taipei in December 2012. Topics include manufacturing technology and processes, design, modeling simulation, and mechanical engineering; robotic, automation, sensors, detection, and monitoring technologies; mechanics, thermal and dynamics systems, vibration, noise, applied mechanics, and numerical simulation applications; materials science and technology and manufacturing processes, and control system modeling and applications. Editors are Wang (Taiwan Society of Android Robotics) and Guo (Harbin Section CIS Chapter, China).