MEMS and Mechanics

MEMS and Mechanics

Description:

Collection of selected, peer reviewed papers from the 2013 International Conference on MEMS and Mechanics (MEMSM 2013), March 15-16, 2013, Wuhan, China.
The papers are grouped as follows:
Chapter 1: Materials Science, Processing, Technology and Engineering;
Chapter 2: MEMS and Mechatronics, Image Processing and Applications;
Chapter 3: Design, Modelling in Manufacture and Manufacturing Technologies;
Chapter 4: AI in Design Engineering, Information Technologies Applications.

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Info:

Editors:
Dehuai Yang
THEMA:
TBC, TGM
BISAC:
TEC021000
Details:
Selected, peer reviewed papers from the 2013 International Conference on MEMS and Mechanics (MEMSM 2013), March 15-16, 2013, Wuhan, China
Pages:
684
Year:
2013
ISBN-13 (softcover):
9783037856994
ISBN-13 (CD):
9783035739138
ISBN-13 (eBook):
9783038260806
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