The 2011 International Conference on Mechatronics and Materials Engineering (ICMME 2011) was held on December 10-12th 2011 in Qiqihar, China. ICMME was initially founded by a network of researchers and engineers from both academia and industry who were working in the areas of mechatronics and materials science.
Volume is indexed by Thomson Reuters CPCI-S (WoS).
All of the accepted papers are to be found in this special volume, which addresses the hottest issues in mechatronics and materials. The volume covers a wide range of topics, including mechatronics materials, mechatronics, materials engineering, engineering mechanics, etc.

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eBook:

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ToC:

Table of contents

Editors:

Elwin Mao and Xibing Li

DOI:

https://doi.org/10.4028/b-M5YqXq

THEMA:

PHV, TGM

BISAC:

TEC021000

Keywords:

Chaotic Neural Network, CNC Lathe, Concept System, Control System, Crack, Data Mining (DM), Emulsion Polymerization, Fault Diagnosis, Finite Element, Finite Element Analysis (FEA), Finite Element Method (FEM), Mathematical Models, Numerical Simulation, Polyacrylate Latex, Principal Component Analysis (PCA), Radial Basis Function (RBF), Short Message, Simulation, TRIZ, Visual C++

Details:

Selected, peer reviewed papers from the 2011 International Conference on Mechatronics and Materials Engineering, (ICMME 2011), December 10-12, Qiqihar, China

Pages:

740

Year:

2012

ISBN-13 (softcover):

9783037853504

ISBN-13 (CD):

9783037951729

ISBN-13 (eBook):

9783038137306

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Review from Ringgold Inc., ProtoView: This collection of technical papers, representing the proceedings of the International Conference on Mechatronics and Materials engineering held in Qiqihar, China in December, 2011, showcases current scholarship in multidisciplinary engineering and the development of cutting edge materials. Topics discussed include combinative mechatronic materials; electrical, materials, and computer engineering projects; traditional materials engineering; engineering mechanics; and control science. Individual papers include keywords, abstracts, and illustration. A volume wide author and keyword index is provided. Contributors are academics in electrical, mechanical, and computer engineering, physics, and materials science from primarily Chinese institutions.