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Description:
This special edition presents the results of recent research and technological developments across diverse areas of materials science and engineering, addressing both advanced semiconductor materials and solutions in environmental engineering and construction and is a valuable resource for researchers, engineers, and students seeking insight into the current technical challenges and innovations.
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Info:
ToC:
Editors:
Dr. Mujtahid Kaavessina, Dr. Manjeet Goyat and Walid Al-Hussaibi
DOI:
https://doi.org/10.4028/b-adfC22
DOI link
THEMA:
TDP, TGM, TJFD, TNK, TQSR
BISAC:
TEC008000, TEC021000
Keywords:
Details:
Special topic volume with invited peer-reviewed papers only
Pages:
176
Year:
2026
ISBN-13 (softcover):
9783036420424
ISBN-13 (eBook):
9783036430430
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Ringgold Subjects:
Materials Science, Building Materials, Civil Engineering