Smart Materials and Intelligent Systems, SMIS2011

Smart Materials and Intelligent Systems, SMIS2011

Description:

Volume is indexed by Thomson Reuters CPCI-S (WoS).
The aim of this special volume is to facilitate the exchange of information on the best practices for multifunctional materials, active materials, enabling technologies and integrated system design, intelligent systems and applications, etc. It provided an opportunity for engineers and scientists in academia, industry and government to address the most innovative research and developments, including technical challenges, social and economic issues, and to discuss their ideas and results in all aspects of Smart Materials and Intelligent Systems.

Purchase this book:

eBook
978-3-03813-788-7
$165.00 *
Print
978-3-03785-345-0
eBook+Print
978-3-03785-345-0
$264.00 *
* 1-User Access (Single User-Price). For Multi-User-Price please fill a contact form

Info:

Editors:
Shaobo Zhong and Xilong Qu
THEMA:
PHV, TBC, TGM
BISAC:
TEC021000
Details:
Selected, peer reviewed papers from the 2011 International Conference on Smart Materials and Intelligent Systems, (SMIS 2011), December 23-25, 2011, Chongqing, China
Pages:
510
Year:
2012
ISBN-13 (softcover):
9783037853450
ISBN-13 (CD):
9783037951675
ISBN-13 (eBook):
9783038137887
Permissions CCC:
Permissions PLS:
Share:

Review from Ringgold Inc., ProtoView: This collection of articles on materials sciences, representing the proceedings of the 2011 international Conference on Smart Materials and Intelligent Systems held in Chongqing, China in December, 2011 showcases current scholarship in a wide variety of topics related to materials design and manufacturing, modeling, and intelligent systems design. Entries are divided into sections covering multi-functional materials, devices and integrated systems, novel manufacturing technologies, mechanical vibration, green manufacturing and control, and engineering management and information systems. Articles include keywords, abstracts, illustrations, and formulas, and both keyword and author indexes are provided. Contributors include academics and researchers from Chinese institutions and technology firms.