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HomeMaterials Science ForumMaterials Science Forum Vols. 408-412Microstructure and Texture of Electrodeposited Cu...

Microstructure and Texture of Electrodeposited Cu on TiN Thin Films without a Cu Seed Layer

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Textures of Materials - ICOTOM 13

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Periodical:

Materials Science Forum (Volumes 408-412)

Pages:

1597-1602

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.408-412.1597

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Online since:

August 2002

Authors:

Ingi Kim, In Soo Kim, Sang-Chul Hong, Do Heyoung Kim

Keywords:

Copper (Cu), Diffusion Barrier, Interconnection, Morpholoy, Palladium Chloride, Texture, Titanium Nitride TiN, Without Cu Seed Layer

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© 2002 Trans Tech Publications Ltd. All Rights Reserved

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