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Articles by author: Feng Wei Huo

• A Method for Grinding Mode Identification in Grinding of Silicon Wafers
  Published in: Precision Surface Finishing and Deburring Technology (p255)
• Characteristics of the Wheel Surface Topography in Ultra-precision Grinding of Silicon Wafers
  Published in: Advances in Abrasive Technology XI (p36)
• Effect of Conditioning Parameters on Surface Non-Uniformity of Polishing Pad in Chemical Mechanical Planarization
  Published in: Advances in Abrasive Technology XI (p498)
• Experimental Investigation of Brittle to Ductile Transition of Single Crystal Silicon by Single Grain Grinding
  Published in: Advances in Abrasive Technology IX (p433)
• Friction-Based In Situ Endpoint Detection of Copper CMP Process
  Published in: Surface Finishing Technology and Surface Engineering (p125)
• Study on the Effect of Nonionic Surfactant in Copper CMP Slurry
  Published in: Surface Finishing Technology and Surface Engineering II (p30)
• The Research on the Improved CMG Tool for Al₂O₃ Ceramic
  Published in: Frontiers of Manufacturing and Design Science II (p514)