Papers by Author: G. Kissinger

Abstract: Chromium-free preferential etching techniques in combination with light optical microscopy were compared with the non-destructive Laser Scattering Tomography (LST) for the evaluation of crystal defect densities in Czochralski substrates grown under different conditions. Dichromate containing etching solutions (original Secco etch and dilute Secco etch) were included into the study as reference. The chromium-free etching solutions with high etch rates comprised mixtures of nitric, hydrofluoric and acetic acid with water (JEITA 1, MEMC). Those with low etch rates consisted of mixtures of nitric and acetic or propanoic acid with hydrogen peroxide which form peracetic or perpropanoic acid (Organic Peracid Etches). OPE solutions provide improved discrimination of different types of defects and work also on highly doped substrates. As a general result, it turned out that the defect densities determined by the preferential etching solutions applied were significantly higher than those evaluated by LST. Relatively close to the LST defect densities are those determined by original Secco etch for larger etch pits.

Abstract: The results of highly sensitive FTIR investigation, ab initio calculations and rate equation modeling of the early stages of oxide precipitation are compared. The attachment of interstitial oxygen to VOn is energetically more favorable than the attachment to On for n  6. For higher n the energy gain is comparable. The point defect species which were detected by highly sensitive FTIR in high oxygen Czochralski silicon wafers are O1, O2, O3, and VO4. Rate equation modeling for I, V, On and VOn with n = (1..4) also yields O1, O2, O3 to appear with decreasing concentration and VO4 as that one of the VOn species which would appear in the highest concentration after RTA.

Abstract: The gravitational induced shear stresses in 200 mm silicon wafers supported in verticaltype or horizontal-type furnace were calculated using 3D-FEM analysis of the displacement vector assuming linear elastic behavior of the anisotropic material. For comparison of the two complex loading cases and for relating the effect of gravitational constraints to the mechanical strength of the wafers, the invariant von Mises shear stress τM was chosen. The computed maximum values of τM demonstrate that the gravitational induced stress for vertical processing is approximately one order of magnitude less than the gravitational induced stress for horizontal processing. The experimental results obtained from processing of 200mm wafers with different oxygen concentration in horizontal and vertical boats at 1200°C are in an excellent agreement with the theoretical simulations.

Abstract: The coherent agglomeration of interstitial oxygen into single-plane and double-plane plates can explain the two peaks in the M-shaped nucleation curves in Czochralski silicon. The density of nucleation sites for the double-plane plates corresponds to the VO2 concentration. Ab initio calculations have shown that the agglomeration of oxygen atoms in single-plane and doubleplane plates is energetically favorable. These plates are under compressive strain. VO2 agglomeration plays only a minor role for modeling the M-shaped nucleation curves because of prior homogenization treatments. It is of much higher impact if as-grown wafers are subjected to nucleation anneals because of the higher vacancy concentration which was frozen in during crystal cooling. This results in higher nucleation rates at higher temperatures. Because the oxygen diffusivity below 700 °C is important for the nucleation rate and many controversial results about the diffusivity in this temperature range were published, we have analyzed the data from literature. We have demonstrated that the effective diffusivity of oxygen at temperatures below 700 °C which corresponds to the quasi equilibrium dimer concentration is very similar to the extrapolation from oxygen diffusivity at high temperature. The high effective diffusivities from out-diffusion and precipitation experiments, and the somewhat lower effective diffusivities from dislocation locking experiments are the result of an ongoing formation of fast diffusing dimers because the equilibrium is disturbed as the result of the strongly increasing difference in the diffusion length between interstitial oxygen and the fast diffusing dimer with decreasing temperature.

Abstract: Nitrogen doping of CZ silicon results in an early formation of large precipitate nuclei during crystal cooling, which are stable at 900°C. These are prone to develop stacking faults and high densities of defects inside defect denuded zones of CZ silicon wafers. Simultaneous doping of FZ silicon with nitrogen and oxygen results in two main stages of precipitate nucleation during crystal cooling, an enhanced nucleation around 800°C, which is nitrogen induced, and a second enhancement around 600°C, which depends on the concentration of residual oxygen on interstitial sites. A combined technique of ramping with 1K/min from 500-1000°C with a final anneal at 1000°C for 2h and lateral BMD measurement by SIRM provides a possibility to delineate v/G on nitrogen-doped silicon wafers. Surface segregation of nitrogen and oxygen during out-diffusion can explain the enhanced BMD formation in about 105m depth and the suppressed BMD formation in about 405m depth below the surface. The precipitate growth is enhanced in regions where nitrogen is filled up again after a preceding out-diffusion.

Abstract: Thermal treatments to enhance precipitation like RTA, ramp anneal and argon anneal were performed on low oxygen 300 mm wafers without vacancy or interstitial agglomerates (“so called” defect-free material). Best results were achieved using high temperature argon anneal leading to a homogenous BMD and denuded zone formation. Furthermore the getter efficiency was positively tested by intentional Ni-contamination. Concepts to overcome the slip danger like improved support geometries and nitrogen codoping were also evaluated and are seen to be beneficial.